Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that it has received a 2011 Supplier Excellence Award from Allegro MicroSystems, Inc. for assembly and test services that were provided by the Carsem factory located in Suzhou, China.

According to Marc Levesque, Sr. Director, Supply Chain Management, “Over the past several years Suzhou has consistently ranked very high on Allegro’s list of suppliers. Suzhou’s overall commitment to quality, delivery/cost, customer satisfaction and technology has been highest in class and has set a new standard for your competitors. We congratulate Suzhou on receiving the Allegro Supplier Excellence Award and we encourage you to continue to strive for perfection!”

The award will be presented to TW Hee, GM of Carsems Suzhou facility by Mr. Marc Levesque, Allegro’s Sr. Director Supply Chain Management. Mr. Levesque stated, “Allegro’s 2011 Excellent Award recognizes suppliers who, in 2011, had achieved a total score for quality, delivery, customer satisfaction and technology of greater than 90%”.

Mr. Peter Yates, Carsem’s Group Managing Director added, “Carsem is honored to be recognized for our achievements in providinghigh volume MLP packaging services. With the tremendous growth in demand for our MLP packages, this award is a reflection of our focus and commitment to expand our Suzhou factory in phase 2 assuring our customers of an uninterrupted supply in both assembly and test”.
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About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

About Allegro
Allegro MicroSystems, Inc. is a leader in developing, manufacturing and marketing high-performance power and Hall-effect sensor integrated circuits. Allegro’s innovative solutions serve high-growth applications within the automotive market, with additional focus on office automation, industrial, and consumer/communications solutions. Allegro is headquartered in Worcester, Massachusetts (USA) with design, applications, and sales support centers located worldwide. Allegro’s product, corporate and financial information are available at their website: www.allegromicro.com

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they are now entering a partnership with a key customer to assemble and further develop LED packaging technologies.Carsem has successfully assembled and qualified High Brightness Silicon Substrate LED Arrays and will begin offering high-volume, full turn-key manufacturing services, including electrical testing, laser mark and tape-and-reel, in early 2012. The manufacturing process fully utilizes the advantage of standard mass production process of assembly and test including matrix substrate design; auto die attach, wire bond and high reflection coating dispense; compression molding through automold system; mapping of units on substrate and bin sort per test mapping.

This Silicon Substrate LED Array offers higher white light brightness with much less energy required (>50 lumens/watt). The life expectancy of the product is estimated at 10 years. General applications can be home use, cars, special light effect, etc.
Albert Law, Carsem’s V.P. of World Wide Sales and Marketing stated, “Because of our extensive experience in providing turnkey solutions, we are able to share our expertise with our LED customers and assist them in getting their products to market faster with turnkey solution on high density and high volume packaging, Carsem is expanding the company’s portfolio to include LED packaging solutions for the High Brightness LED applications.”

Carsem’s Chief Technology Officer, L.W. Yong stated, “By capitalizing on our extensive semiconductor experience in materials, process & equipment we have successfully advanced into the LED arena and thereby enhancing the manufacturability and efficiency of High Brightness LED”

Anyone interested in further details about this new package should contact your local Carsem sales office, which can be found on the Carsem web site at www.carsem.com.

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Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

Responsibilities:

• Attend to MES related issues on a timely manner
• Maintain MES oracle database, application and reporting server.
• Monitor and improve performance to support production.

Requirements:-

• Degree in Computer Science / Information Technology or it’s equivalent.
• Minimum 2 years experience in a semiconductor environment.
• Requires knowledge in VB6, ASP.NET, C++.NET or VB.NET and in Oracle database administration.
• Knowledge in MSSQL will be of added advantage.
• Positive mind set and willingness to be on call support.
• Able to work independently with good team spirit.
• Fresh graduates with CGPA 3.0 and above, preferred.

Responsibilities

• Prepare all necessary documents and information to finished good stores for timely shipment of goods to the correct destination.
• Arrange travellers to be sent for shipment.
• Constant monitoring and follow ups to ensure delivery. Report any possible or potential delays to Supervisors.
• Generate timely and accurate reports to customers.
• Prepare specific production schedule to assembly.
• Ensure proper handling of rework material and wafer to be returned to customers upon request.
• Ensure and arrange “drop shipment” to correct destination assigned by customers on a timely manner.
• Monitor updating data entry on material issue.

Requirements:

• Minimum Diploma with related experience preferred.
• Good Microsoft knowledge (eg. words, excel and powerpoint).
• Good communication skill in English is compulsory.
• Computer literate and a team player.

Responsibilities:

• Prepare daily production schedule, customer batching and follow up with pre-assembly team.
• Expedite lots for schedule and work closely with production team to maximise daily input according to machine utilization.
• Liaise with support groups on engineering & quality matters.
• Generate timely and accurate reports to customers

Requirement:

• Diploma holders or it’s equivalent.
• Minimum 2 years related experience preferred.
• Good communication, planning and organizing skills required.
• Demonstrates good level of self discipline.
• An excellent team player.

In these times, continuity of supply is an important consideration for Carsem customers. Carsem’s situation is as follows :

1. Carsem does not procure any direct or consumable material from Thailaind for its assembly and test.

2. The direct and consumable materials used in Carsem assembly and test are not manufactured in Thailand.

These 2 statements apply to ALL Carsem assembly and test facilities. thus, there will be no impact or disruption to its factories.

Carsem extends its thoughts and prayers to its Thai neigbours during these dire times.

Exar’s CEO and President, Pete Rodriquez, presented the award in a ceremony held at Exar’s headquarters located in Fremont, Calif.
Mr. Rodriquez stated, “Carsem is one of our key suppliers providing assembly, final test and drop ship services for many products and a variety of package types. This past year Carsem has done an exceptional job and we are looking forward to their continued support.”
Mr. Peter Yates, Carsem’s Group Managing Director added, “The Ipoh factory team has done an outstanding job in supporting Exar’s needs and we are extremely pleased to receive this special recognition. Our dedicated team will continue to stay focused on our strong partner relationship with Exar well into future.”
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

The award was presented by, Microsemi’s Supply Chain Manager, Mr. Don Peterson to Carsem Suzhou’s General Manager, T.W. Hee in a ceremony held at the Carsem Suzhou factory on May 25, 2011.
Mr. Peterson stated, “It is particularly noteworthy that Carsem’s outstanding support of Microsemi has earned them this second straight supplier award. It represents an important contribution to Microsemi’s continuing growth in our competitive industry.”
“Microsemi is one of our major business partners and we are very proud that our dedicated Caresm team has once again received the Best Supplier of the Year Award,” stated Mr. Hee.
Mr. Peter Yates, Carsem’s Group Managing Director added, “the Suzhou factory team has done an outstanding job in further strengthening our strong partner relationship with Microsemi’s dedicated staff and we are extremely pleased to receive this prestigious award for the second straight year. We will continue to stay focused on the strong relationship that we have developed with Microsemi well into the future.”

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.
About Microsemi
Microsemi Corporation (Nasdaq:MSCC) offers the industry’s most comprehensive portfolio of semiconductor technology. Committed to solving the most critical system challenges, Microsemi’s products include high-performance, high-reliability analog and RF devices, mixed signal integrated circuits, FPGAs and customizable SoCs, and complete subsystems. Microsemi serves leading system manufacturers around the world in the defense, security, aerospace, enterprise, commercial, and industrial markets. Learn more at http://www.microsemi.com.

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they are expanding their Suzhou, China factory size by an additional 40,000 square meters (430,000 square feet). The ground breaking for the new facility expansion commenced in Q1 2011 and production operations are expected to begin in Q1 2012. The expansion will bring the total factory size to 56,000 square meters (600,000 square feet) and will allow Carsem to increase their Suzhou factory Micro Leadframe Package (MLP) capacity from the current 5 million units per day to over 20 million per day. The new expansion will be used to meet the future needs of Carsem’s existing as well as new potential customers and will incorporate a major focus on copper wirebond expansion as well as the more traditional gold wirebond products.

The daily capacity expansion in assembly will be matched with an equal proportion of test capacity. This will bring Carsem’s total MLP manufacturing capacity in both their Ipoh, Malaysia and Suzhou, China factory locations to over 26 million units per day.

Mr. Rick Flowers, Carsem’s V.P. of World Wide Sales and Marketing stated, “We are continuing to see a tremendous rate of growth in the demand for our MLP package family and Carsem will continue to make major investments in our MLP capacity and related technologies in order to assure our customers of an uninterrupted supply.”

Carsem MLP’s are QFN (Quad Flat No-lead) and SON (Small Outline No-lead) type packages that are compliant to JEDEC’s MO220 and MO229 standards and are also offered with enhanced technologies such as copper-clip, flip-chip, system-in-package as well as the extremely thin X3 version that is only 0.3mm thick.

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About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.www.carsem.com.

Dr. Hsieh stated, “Carsem’s outstanding service and support were key factors in helping grow our business last year. We will continue to maintain our outstanding partnership with Carsem as we move forward.”

“It is an honor to be recognized as the Best Supplier by Richtek, who is also one of our major partners in the business and we are very proud of our dedicated team at Carsem Suzhou,” stated Mr. Hee.

Mr. Rick Flowers, Carsem’s Vice President of Worldwide Sales and Marketing, added, “Carsem is committed to providing outstanding support and service to the industry and we look forward to continuing our strong relationship with Richtek well into the future.”

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About Carsem

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

About Richtek

Richtek Technology Corporation is one of the world’s leading analog IC companies. The company consistently delivers inventive power management solutions that improve the performance of consumer electronics, computers, and communications equipment. Richtek adds value to end equipment by synthesizing technological innovation, uncompromised quality, and devotion to customer service. Founded in 1998, the Company is headquartered in Taiwan with additional offices in Asia, the U.S., and Europe. Richtek is publicly traded on the Taiwan Stock Exchange under the ticker symbol 6286. For more information about Richtek and its analog IC solutions, please visit the Company’s Web site at www.richtek.com.