Carsem is focused on turn-key services and thus has a total dedicated test and wafer probe area of 105,000 sq ft (9,800 sq m) containing over 500 testers and handlers. Carsem provides a full range of test services to meet the unique needs of our customer's device requirements including RF, mixed signal and power applications and currently test over 60% of the total units we assemble. (For more information about the MLP package family click here)

Carsem maintains a dynamic tester and handler technology roadmap to align our investments to our customer's needs and has a core dedicated staff of product, process and test engineers capable of developing custom solutions from scratch to address any specific device requirements. These solutions include program/hardware development services, program conversions, as well as, complete product engineering support including program debug, correlation, low yield analysis and test time reduction.

We have the ability to test devices for Bluetooth, WLAN, 802.11a/b and a wide variety of other applications using test systems that include the LTX Fusion CX RF, Agilent 84000, Rack and Stack and Teradyne Catalyst/RF. Additional tester platforms for mixed signal, analog and power management devices include the TMT/ASL, Eagle, and Teradyne Microflex. Carsem provides both wafer probe services for wafers up to 8" in diameter (including hot chuck and wafer mapping features) and strip test for various MLP package dimensions (including packages sizes below 2x2 mm) . Other turn-key services include dry pack, tape and reel, finished goods inventory, bar code and drop shipment.

FACILITIES

Floor Space : 105k sq. ft. (9.8K M²)

• Temperature : 23 +/- 4°C
• Humidity : 50 +/- 10%

• Static Dissipative Flooring
• Conductive Shoes
• In-handler Ionizers
• Grounded Work Stations

EQUIPMENT

• TSK Model : Tokyo SEMITSU A-PM-90A
• 4" to 8" Wafer Handling
• In-Line or Off-Line Inking
• Wafer Mapping Software
• Capability to Download Wafer Map to PC
• Auto Wafer and Probe-to-Pad Alignment
• Yield Check for Continuous Fail Alert System
• Probe Mark & Wafer ID Inspection
• Hot Chuck

• Systemation Peel Strength
• Giant Force Bake Ovens
• Itermec Barcode Printers
• Strappers and Sealers
• Micro VU Profile Projector
• ICOS CI9450, MQFP, LQFP Lead Scanner

SERVICES

We have over 50 highly trained & experienced engineers in our test organization. Below is a highlight of some of the services and capabilities.

Product Engineering

• Test program debug & correlation
• Low Yield Analysis
• Yield improvement
• Product Failure Analysis
• Comprehensive Test Program
• Release Controls

Test Development

• Using both internal resources and third party relationships with test development and ATE companies, we have the ability to design and develop software and hardware on major test platforms including Teradyne A5xx series, Catalyst, TMT, EAGLE and LTX.

Equipment Engineering

• Fully trained to be self-sufficient in calibration and repair of all equipment
• Coordination of sockets, contactors and handlers for all new Carsem packages

• Customised advanved lot tracking system
• Reliability testing
• Lead scanning
• Dry packing
• Tape & Reel
• Drop ship

Remote Access

• Customer Engineers are able to remotely login to the Tester work station to debug technical issues

Program/File Managment

• Login account and password will be assigned
• Comprehensive Managment Prorocedures
• Network Testers
• Carsem Ethernet

Transfer Modes

• File Transfer Protocol (FTP)
• ISDN Link
• Floppy
• CD