SOP Packages

Packaging
 
 
 
 
 
 
 
 
Testing
Latest Technology Solutions
 
SOP PACKAGES
Carsem offers a wide variety of SOP (Small Outline Package) in the popular "gull-wing" lead format. Body sizes range from 3 x 3mm for the MSOP to the 7.5 x 17.83mm wide body SOIC. Lead counts range from 8 to 56 with lead pitches from 0.5mm to 0.8mm.

Availability

SOIC
 : Small Outline Integrated Circuit
SSOP
 : Shrink Small Outline Package
QSOP
 : Quarter-pitch Small Outline Package
TSSOP
 : Thin Shrink Small Outline Package
MSOP
 : Mini Small Outline Package

Package Type Lead Count
SOIC (150 mil)8/14/16
SOIC (300 mil)16/20/24/28
QSOP (150 mil)16/20/24/28
QSOP (300 mil)36/44
SSOP (5.3mm)20/24/28
MSOP (3.0mm)8/10
TSSOP (4.4mm)8/14/16/20/24/28/38
TSSOP (6.1mm)48/56

Bill of Material

  SOIC
Leadframe CDA 194
Die Attach Conductive Epoxy - QMI 519
Wire Bond 1.0 / 1.3 mils gold wire (Cu Wire Optonal)
Green Mold Compound HITACHI CEL 8240 SERIES
Lead Finish 100% matte Tin or NiPdAu
Marking Top - Laser
Packing Tube or Tape & Reel
Process Flow Carsem (M)
CFCM-HD-STD
JEDEC Reference MS-012 (150 mils)
MS-013 (300 mils)
  SSOP(5.3mm) QSOP
Leadframe CDA 194
Die Attach Conductive Epoxy - QMI 519
Wire Bond 1.0 / 1.3 mils gold wire (Cu Wire Optonal)
Mold Compound HITACHI CEL 8240 SERIES (Green) HITACHI CEL 8240 SERIES (Green)
Lead Finish 100% matte Tin or NiPdAu
Marking Top - Laser
Packing Tube or Tape & Reel
Process Flow CFCM-HD-STD Csm(M) : CFCM-HD-STD
Csm(S) : CFCS-QSOP-NBM
JEDEC Reference MO-150 MO-137 (150 mils)
N/A (300 mils)
  TSSOP(4.4 & 6.1mm) MSOP(3.0mm)
Leadframe CDA 7025 CDA 194
Die Attach Conductive Epoxy - QMI 519
Wire Bond 1.0 / 1.3 mils gold wire (Cu Wire Optonal)
Mold Compound TSSOP 4.4 : HITACHI
CEL 8240 SERIES
& TSSOP 6.1 : G700 SERIES 		HITACHI CEL 8240 SERIES
Lead Finish 100% matte Tin or NiPdAu
Marking Top - Laser
Packing Antistatic Tube/Plugs
Process Flow Csm(M) : CFCM-HD-STD
Csm(S) : CFCS-TSSOP-LTM		 Csm(M) : CFCM-HD-STD
JEDEC Reference MO-153 MO-187

Package Performance

Reliability Data
Reference Specifications
Mil Standard 883 for Test Method and Procedures
J-STD-20 Moisture/Reflow Sensitivity Classification
JESD 22- A113 for Preconditioning for Moisture / Reflow Sensitivity Classification

Stress Conditions
Autoclave 96 hours 121°C / 100% RH, 2 atm
Temp. Cycle 200,500,1000 cycles -65°C / +150°C
Thermal Shock N/A N/A

Reliability & MSL Results
Please Contact Sales Office for Package Specific Results

Thermal Data
Please CLICK to view

Electrical Data
Please CLICK to view

Datasheet / Drawings

Datasheet
Please contact Sales Office

Drawings
CLICK to view Package Outline
SOIC - 150 mils QSOP - 150 mils / Matrix
SOIC - 300 mils QSOP - 300 mils
SSOP MSOP - 8 / 10 L
TSSOP