Carsem offers a wide range of turn-key test
services and has a total dedicated test area of 69,000
sq ft (6,417 M2)containing over 230 test systems.
We provide a full range of test solutions and services for
RF, mixed-signal, analog, digital and power devices and currently
test over 60% of the total units we assemble, which is one
of the highest percentages in the industry. (For more information
about the MLP package family click here on MLP
test solutions).
We have the ability to test devices for Bluetooth, WLAN, 802.11a/b and a
wide variety of other applications using test systems that include the LTX
Fusion CX, Agilent 84000, Teradyne Catalyst/RF, as well as the Teradyne
A360/535/565/575 series testers. Other tester platforms for mixed signal,
analog and power management devices include the TMT, Eagle, ATR, and LTX-77. We also have Credence and an
assortment of other systems for testing digital and power devices. Carsem
provides wafer probe services for wafers up to 8" in diameter including hot
chuck and map features. Other turn-key services include dry pack, tape
and reel, finished goods inventory, bar code and drop ship.
In addition, Carsem's extensive test engineering staff provides complete
test program/hardware development services, program conversions as
well as complete product engineering support including program debug,
correlation, low yield analysis and test time reduction.
FACILITIES
Location :
M-Site
Floor Space : 14k sq. ft. (1.3K M2) |
S-Site
Floor Space : 55k sq. ft. (5.1K M2) |
Environment :
- Temperature : 23 +/- 4°C
- Humidity : 50 +/- 10%
ESD Controls :
- Static Dissipative Flooring
- Conductive Shoes
- In-handler Ionizers
- Grounded Work Stations
EQUIPMENT
Digital Testers
| Mixed Signal Testers |
RF Testers| Handlers | Wafer
Probe |
Other Test Equipment
DIGITAL Tester
| Manufacturer |
Model |
Speed |
Memory |
Pins |
Head |
| CREDENCE |
SC212 |
50 |
4M |
128 |
1 |
MIXED SIGNAL
Testers
| Manufacturer |
Model |
Capability |
| TERADYNE |
A360 |
Mixed Signal Tester, M625
AC option |
| A530 |
24dig. Pins, 48 ana.pins,
8VI, PACs, UHFCW |
| A535 |
Digital Option available,
PACs, VHFCW, UHFCW, VNA |
| A565 |
Path ii Test head with 8 APUs,
PACs, PVI |
| A575 |
112 digital pins and 48 analog
pins, PACS |
| CATALYST-100 |
56 Digital pins, 100Mhz, PACS |
| CREDENCE |
ASL1000 |
DVI, MUX, TMU, PVI, ACS, OAL,
OVI, PV3 |
| ASL3000 |
DVI2K, DVI300, MUX |
| LTX |
TS88/TS80 with
MV200/PE3000 |
5
VI, 16 pin matrix, TFE |
| |
| |
SYNCHROMASTER |
48 digital and 32 analog pins,
VMS08, RFO1 |
| |
FUSION CX |
802.11 A/B/G, 32OVI, 24DIG,
8RF16Port, 4 SIGGEN |
| ANALOG |
LCT-L1/CTS 5010 |
2V/I, 6QVI, Digital & Analog
Support Card, ADC card, DUT Source B. |
| EAGLE |
ETS-500D |
FSS, MPU, APU, DSS, QMS |
| ETS-564 |
FSS, MPU, APU, QMS |
| ETS-300 |
FSS, MPU, APU, DSS, QMS, WCU |
| SZ |
M3610 |
APIN, DPIN, VPIN, TMUX, Power
VI Source |
| DTS |
CUSTOM BUILT |
N.A. |
DOLAIN
GRAPHICS |
DG50015/100020 |
N.A. |
| HP |
HP9470 |
N.A. |
| ITC |
5511/5514 |
N.A. |
| PC BASED |
HP CV METER |
N.A. |
| CUSTOM BUILT |
| ATR |
MTS-2010 |
N.A. |
TEST
INNOVATION |
TSA |
N.A. |
| TESEC |
8101-TT |
N.A. |
| 881-TT/A |
| 9614/6915 Delta Vsd |
| 8114/8115 Delta Vsd |
RF Testers
| Manufacturer |
Model |
Capability |
| AGILENT |
HP84000 |
3RF Ports, CWSRC 2.996 GHz, DC Resources,
+/- 20 V; max 12A, DUT Resources +/-12 V max 120 watt |
CREDENCE
TMT |
ASL3000RF |
8 High Power Ports 6GHz, 3SMIQ SigGem,
DVI2K, OVI300 |
| HP |
HP84000 |
3 RF Ports, CWSRC 36GHz, DC
Resouces |
| LTX |
FUSION CX |
802.11 A/B/G, 32OVI, 24DIG,
8RF16Port, 4 SIGGEN |
| TERADYNE |
CATALYST-100 (RF) |
6GHz with Frequency Hopping |
| A535 |
Gen2 VNA/td>
|
| A530/A535 |
UHF & VHF, 5 V/Is, 8 channel,
High Speed Digital |
| TEKTRONIX |
VXI Rack & Stack |
Tektronix DMM 1.3GHz, 1 SigGem,
Spectrum Analyzer 6.7GHz |
Handlers
| Manufacturer |
Model |
Test Sites |
Package Capability |
| AETRIUM |
5050 |
1 |
SOICN | SOICW |
| DTS |
2 |
48, 56 TSSOP |
| QTS |
4 |
SOICN | SOICW |
| ASECO |
S170 |
1 |
SOICN |
| DELTAFLEX |
1240 |
1 |
QFP | MLP | ARRAY PACKAGES |
| EXATRON |
27010 |
1 |
SOIC |
| FSA |
ATH-T5092 |
1 |
TO92 |
| HITACHI |
MH10 |
2 |
MQFP |
| ISMECA |
TMBU-GA |
1 |
SOT223 | 3 SOT23 |
| NT216 |
2 |
3,5,6 SOT23 | 5, 6 SC70 | SOD323 |
| TH4K |
1 |
3 SOT23 |
| MCT |
4610/4600 |
1 |
28, 44 PLCC |
| 5100DUA |
1 |
TSSOP |
| 3608 |
1 |
3 SOT 23 | 8, 14, 16 SOIC | 3, 5 DDPAK |
| MH |
813 |
1 |
SOT223 | SO8 |
| MULTITEST |
8503 |
1 |
44 PLCC |
| 8704 |
1 |
SOICN | SSOP |
| 9308 |
2/4 |
QSOP | SOICN | TSSOP |
| 240 |
1 |
SOT223 | TO220 | SOIC |
| SIMECA |
STV242 |
1 |
3, 5, 6 SOT23 | SOT223 | SOT143 |
| SYNAX |
1213 |
2 |
QFP | MLP | ARRAY PACKAGES |
| 141V |
1 |
| TALAKA |
EH4000 |
1 |
TO92 |
| TESEC |
786 |
1 |
TO92 |
| 9418-HT |
1 |
5 SOT23 |
| 9718-HT |
1 |
5, 6 SOT23 |
| 8918 |
1 |
3, 6 SOT23 | SOT223 |
| 9428-HT |
1 |
8 MSOP |
| 9110 |
1 |
SOT223 | SO8 |
Wafer Probe
| Manufacturer |
Model |
Test Sites |
Package Capability |
| TSK |
APM90A |
1 |
Wafer Probe (4"-8") |
| UF200 |
1 |
Wafer Probe (4"-8") with wafer
mapping capability |
| EG |
EG2001, 2080 |
1 |
Wafer Probe (6") with wafer mapping capability |
| TEL |
TEL8 |
1 |
Wafer Probe (6") with wafer
mapping capability |
- TSK Model : Tokyo SEMITSU A-PM-90A
- 4" to 8" Wafer Handling
- In-Line or Off-Line Inking
- Wafer Mapping Software
- Capability to Download Wafer Map to PC
- Auto Wafer and Probe-to-Pad Alignment
- Yield Check for Continuous Fail Alert System
- Probe Mark & Wafer ID Inspection
- Hot Chuck
|
Other Test Equipment
- Systemation Peel Strength
- Giant Force Bake Ovens
- Itermec Barcode Printers
|
- Strappers and Sealers
- Micro VU Profile Projector
- ICOS CI9450, MQFP,
LQFP Lead Scanner
|
SERVICES
Test Engineering
| Other Services | IT in Test
We have over 50 highly trained & experienced engineers in
our test organization. Below is a highlight of some of the
services and capabilities.
Test Engineering
Product Engineering
- Test program debug & correlation
- Low Yield Analysis
- Yield improvement
- Product Failure Analysis
- Comprehensive Test Program
- Release Controls
|
Test Development
- Using both internal resources and third
party relationships with test development and ATE
companies, we have the ability to design and develop
software and hardware on major test platforms including
Teradyne A5xx series, Catalyst, TMT, EAGLE and LTX.
|
Equipment Engineering
- Fully trained to be self-sufficient in calibration and repair of all equipment
- Coordination of sockets, contactors and handlers for all new Carsem packages
|
Other Services
- Customised advanved lot tracking system
- Reliability testing
- Lead scanning
- Dry packing
- Tape & Reel
- Drop ship
|
IT in Test
Remote Access
- Customer Engineers are able to remotely
login to the Tester work station to debug technical
issues
|
Program/File Managment
- Login account and password will be
assigned
- Comprehensive Managment Prorocedures
- Network Testers
- Carsem Ethernet
|
 |
Transfer Modes
- File Transfer Protocol (FTP)
- ISDN Link
- Floppy
- CD
|
|
