Carsem offers a wide variety of SOP (Small Outline Package) in the popular "gull-wing" lead format. Body sizes range from 3 x 3mm for the MSOP to the 7.5 x 17.83mm QSOP. Lead counts range from 8 to 56 with lead pitches from 0.5mm to 0.8mm.

Availability	Bill of Material	Package Performance	Datasheet/Drawings
SOIC Leadframe CDA 194 Die Attach Conductive Epoxy - 84-1 LMI-SR4 Wire Bond 1.0 / 1.3 mils gold wire Mold Compound Sumitomo 6600 Series G600 Series (Green) Lead Finish Solder Plate or 100% matteTin Marking Top - Ink/Laser     ||    Bottom - Laser Packing Antistatic Tubes/Plugs Process Flow Carsem (M) Carsem (S) CFC-SOIC-8LDMAT CFCS-SOIC CFC-SOICWB-MAT CFC-SOICNB-MAT JEDEC Reference MS-012 (150 mils) MS-013 (300 mils)   SSOP(5.3mm) QSOP Leadframe CDA 194 Die Attach Conductive Epoxy - 84-1 LMI-SR4 Wire Bond 1.0 / 1.3 mils gold wire Mold Compound Shinetsu KMC 184 G700 Series (Green) Sumitomo 6600 Series G600 Series (Green) Lead Finish Solder Plate or 100% matteTin Marking Top - Ink/Laser     ||     Bottom - Laser Packing Antistatic Tubes/Plugs Process Flow CFCS-5.3MM SSOP-NBM Csm(M) : CFCM-QSOP Csm(S) : CFCS-QSOP-NBM JEDEC Reference MO-150 MO-137 (150 mils) N/A (300 mils) . TSSOP(4.4 & 6.1mm) MSOP(3.0mm) Leadframe CDA 7025 CDA 194 Die Attach Conductive Epoxy - 84-1 LMI-SR4 Wire Bond 1.0 / 1.3 mils gold wire Mold Compound Sumitomo 7351 Series G700 Series (Green) Sumitomo 6600 Series Lead Finish Solder Plate or 100% matteTin Marking Top - Ink/Laser     ||     Bottom - Laser Packing Antistatic Tubes/Plugs Process Flow CFCS-TSSOP-NBM CFCM-MSOP-STD JEDEC Reference MO-153 MO-187