Carsem offers a wide variety of JEDEC compliant QFP (Quad Flat Package) leaded packages for medium to high pin count IC's. The MQFP is available in body sizes ranging from 10 x 10mm to 14 x 20mm with lead counts from 24 to 100. The LQFP is a family of 1.4mm thick packages with body sizes ranging from 7 x 7mm to 10 x 10mm and lead counts from 32 to 64.

Availability	Bill of Material	Package Performance	Datasheet/Drawings
Reliability Data Reference Specifications Mil Standard 883 for Test Method and Procedures J-STD-20A method A112 for Moisture Sensitivity J-STD-20A method A113 for Preconditioning Stress Conditions Autoclave 1008 hours 121°C / 100% RH, 2 atm Temp. Cycle 1000 cycles -65°C / +150°C Thermal Shock 300 cycles -55°C / +125°C   Reliability & MSL Results Please Contact Sales Office for Package Specific Results Thermal Data Please CLICK to view Electrical Data Please CLICK to view