Carsem offers a wide variety of JEDEC compliant QFP (Quad Flat Package) leaded packages for medium to high pin count IC's. The MQFP is available in body sizes ranging from 10 x 10mm to 14 x 20mm with lead counts from 24 to 100. The LQFP is a family of 1.4mm thick packages with body sizes ranging from 7 x 7mm to 10 x 10mm and lead counts from 32 to 64.

Availability	Bill of Material	Package Performance	Datasheet/Drawings
MQFP LQFP/TQFP Leadframe C7025 / KLF125 / EFTEC64T Die Attach 84-1 LMI-SR4/SNB Wire Bond 1.0 / 1.2 / 1.3mils gold wire Mold Compound Sumitomo 6650* Series G600 Series (Green) Sumitomo 7351 Series G700 Series (Green) Lead Finish Solder Plate or 100% matte Tin Marking Laser Packing (JEDEC Trays) Bakeable - Thin Profile Non-bakeable - Thin Profile Process Flow CFC-QFP-LTM-NSD (Dry Pack) CFC-QFP-NSD-DP (Dry Pack) CFC-QFP-LTM (No Dry Pack) CFC-QFP-NSD-NDP (No Dry Pack) JEDEC Reference MS-022 3.2mm Footprint MO-112 3.9mm Footprint MO-143 2.6mm Footprint MS-026 2.0mm Footprint