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SPECIAL PROCESSES
SiP
: System in Package
FCOL™
: Flip Chip on Leadframe
COL
: Chip On Lead
Carsem Receives Favorable Decision in Patent Litigation Case
Carsem Receives Microsemi Corporation's Best Supplier of the Year Award for 2009
Carsem Receives The 2009 Award for Best External Manufacturing and Testing from Skyworks
Carsem's Micro-Packages Article in Chip Scale Review
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