Carsem offers a wide range of turn-key test services and has a total dedicated test area of 69,000 sq ft (6,417 M2)containing over 230 test systems. We provide a full range of test solutions and services for RF, mixed-signal, analog, digital and power devices and currently test over 60% of the total units we assemble, which is one of the highest percentages in the industry. (For more information about the MLP package family click here on MLP test solutions).
We have the ability to test devices for Bluetooth, WLAN, 802.11a/b and a wide variety of other applications using test systems that include the LTX Fusion CX, Agilent 84000, Teradyne Catalyst/RF, as well as the Teradyne A360/535/565/575 series testers. Other tester platforms for mixed signal, analog and power management devices include the TMT, Eagle, ATR, and LTX-77. We also have Credence and an assortment of other systems for testing digital and power devices. Carsem provides wafer probe services for wafers up to 8" in diameter including hot chuck and map features. Other turn-key services include dry pack, tape and reel, finished goods inventory, bar code and drop ship.
In addition, Carsem's extensive test engineering staff provides complete test program/hardware development services, program conversions as well as complete product engineering support including program debug, correlation, low yield analysis and test time reduction.
FACILITIES
Location :
M-Site Floor Space : 14k sq. ft. (1.3K M2) |
S-Site Floor Space : 55k sq. ft. (5.1K M2) |
Environment :
- Temperature : 23 +/- 4°C
- Humidity : 50 +/- 10%
ESD Controls :
- Static Dissipative Flooring
- Conductive Shoes
- In-handler Ionizers
- Grounded Work Stations
EQUIPMENT
Digital Testers
| Mixed Signal Testers |
RF Testers| Handlers | Wafer
Probe |
Other Test Equipment
| Manufacturer | Model | Speed | Memory | Pins | Head |
| CREDENCE | SC212 | 50 | 4M | 128 | 1 |
| Manufacturer | Model | Capability |
| TERADYNE | A360 | Mixed Signal Tester, M625 AC option |
| A530 | 24dig. Pins, 48 ana.pins, 8VI, PACs, UHFCW | |
| A535 | Digital Option available, PACs, VHFCW, UHFCW, VNA | |
| A565 | Path ii Test head with 8 APUs, PACs, PVI | |
| A575 | 112 digital pins and 48 analog pins, PACS | |
| CATALYST-100 | 56 Digital pins, 100Mhz, PACS | |
| CREDENCE | ASL1000 | DVI, MUX, TMU, PVI, ACS, OAL, OVI, PV3 |
| ASL3000 | DVI2K, DVI300, MUX | |
| LTX | TS88/TS80 with MV200/PE3000 |
5 VI, 16 pin matrix, TFE |
| SYNCHROMASTER | 48 digital and 32 analog pins, VMS08, RFO1 | |
| FUSION CX | 802.11 A/B/G, 32OVI, 24DIG, 8RF16Port, 4 SIGGEN | |
| ANALOG | LCT-L1/CTS 5010 | 2V/I, 6QVI, Digital & Analog Support Card, ADC card, DUT Source B. |
| EAGLE | ETS-500D | FSS, MPU, APU, DSS, QMS |
| ETS-564 | FSS, MPU, APU, QMS | |
| ETS-300 | FSS, MPU, APU, DSS, QMS, WCU | |
| SZ | M3610 | APIN, DPIN, VPIN, TMUX, Power VI Source |
| DTS | CUSTOM BUILT | N.A. |
| DOLAIN GRAPHICS |
DG50015/100020 | N.A. |
| HP | HP9470 | N.A. |
| ITC | 5511/5514 | N.A. |
| PC BASED | HP CV METER | N.A. |
| CUSTOM BUILT | ||
| ATR | MTS-2010 | N.A. |
| TEST INNOVATION |
TSA | N.A. |
| TESEC | 8101-TT | N.A. |
| 881-TT/A | ||
| 9614/6915 Delta Vsd | ||
| 8114/8115 Delta Vsd |
| Manufacturer | Model |
| CREDENCE | EPRO 142X |
| DOLAIN GRAPHICS | DG50015/100020 |
| EPRO | 142X |
| ITC | 5511/5514 |
| PC BASED | HP CV Meter Custom Built |
| KAT | KAT7000t |
| ATR | MTS-2010 |
| TEST INNOVATION | TSA |
| TESEC | 8101-TT |
| 881-TT/A | |
| 9614/6915 Delta Vsd | |
| 8114/8115 Delta Vsd |
| Manufacturer | Model | Capability |
| AGILENT | HP84000 | 3RF Ports, CWSRC 2.996 GHz, DC Resources, +/- 20 V; max 12A, DUT Resources +/-12 V max 120 watt |
| CREDENCE TMT |
ASL3000RF | 8 High Power Ports 6GHz, 3SMIQ SigGem, DVI2K, OVI300 |
| HP | HP84000 | 3 RF Ports, CWSRC 36GHz, DC Resouces |
| LTX | FUSION CX | 802.11 A/B/G, 32OVI, 24DIG, 8RF16Port, 4 SIGGEN |
| TERADYNE | CATALYST-100 (RF) | 6GHz with Frequency Hopping |
| A535 | Gen2 VNA/td> | |
| A530/A535 | UHF & VHF, 5 V/Is, 8 channel, High Speed Digital | |
| TEKTRONIX | VXI Rack & Stack | Tektronix DMM 1.3GHz, 1 SigGem, Spectrum Analyzer 6.7GHz |
| Manufacturer | Model | Test Sites | Package Capability |
| AETRIUM | 5050 | 1 | SOICN | SOICW |
| DTS | 2 | 48, 56 TSSOP | |
| QTS | 4 | SOICN | SOICW | |
| ASECO | S170 | 1 | SOICN |
| DELTAFLEX | 1240 | 1 | QFP | MLP | ARRAY PACKAGES |
| EXATRON | 27010 | 1 | SOIC |
| FSA | ATH-T5092 | 1 | TO92 |
| HITACHI | MH10 | 2 | MQFP |
| ISMECA | TMBU-GA | 1 | SOT223 | 3 SOT23 |
| NT216 | 2 | 3,5,6 SOT23 | 5, 6 SC70 | SOD323 | |
| TH4K | 1 | 3 SOT23 | |
| MCT | 4610/4600 | 1 | 28, 44 PLCC |
| 5100DUA | 1 | TSSOP | |
| 3608 | 1 | 3 SOT 23 | 8, 14, 16 SOIC | 3, 5 DDPAK | |
| MH | 813 | 1 | SOT223 | SO8 |
| MULTITEST | 8503 | 1 | 44 PLCC |
| 8704 | 1 | SOICN | SSOP | |
| 9308 | 2/4 | QSOP | SOICN | TSSOP | |
| 240 | 1 | SOT223 | TO220 | SOIC | |
| SIMECA | STV242 | 1 | 3, 5, 6 SOT23 | SOT223 | SOT143 |
| SYNAX | 1213 | 2 | QFP | MLP | ARRAY PACKAGES |
| 141V | 1 | ||
| TALAKA | EH4000 | 1 | TO92 |
| TESEC | 786 | 1 | TO92 |
| 9418-HT | 1 | 5 SOT23 | |
| 9718-HT | 1 | 5, 6 SOT23 | |
| 8918 | 1 | 3, 6 SOT23 | SOT223 | |
| 9428-HT | 1 | 8 MSOP | |
| 9110 | 1 | SOT223 | SO8 |
| Manufacturer | Model | Test Sites | Package Capability |
| TSK | APM90A | 1 | Wafer Probe (4"-8") |
| UF200 | 1 | Wafer Probe (4"-8") with wafer mapping capability | |
| EG | EG2001, 2080 | 1 | Wafer Probe (6") with wafer mapping capability |
| TEL | TEL8 | 1 | Wafer Probe (6") with wafer mapping capability |
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SERVICES
Test Engineering | Other Services | IT in Test
We have over 50 highly trained & experienced engineers in our test organization. Below is a highlight of some of the services and capabilities.
Test Engineering
Product Engineering
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Test Development
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Equipment Engineering
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Remote Access
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Program/File Managment
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Transfer Modes
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