SOP PACKAGES

Carsem offers a wide variety of SOP (Small Outline Package) in the popular "gull-wing" lead format. Body sizes range from 3 x 3mm for the MSOP to the 7.5 x 17.83mm QSOP. Lead counts range from 8 to 56 with lead pitches from 0.5mm to 0.8mm.

Availability

SOIC : Small Outline Integrated Circuit
SSOP : Shrink Small Outline Package
QSOP : Quarter-size Small Outline Package
TSSOP : Thin Shrink Small Outline Package
MSOP : Mini Small Outline Package
Package Type
MSOP (3.0mm)
QSOP (150 mil)
QSOP (300 mil)
SOIC (150 mil)
SOIC (300 mil)
SSOP (5.3mm)
TSSOP (4.4mm)
TSSOP (6.1mm)
 Lead Count
8/10
16/20/24/28
36/44
8/14/16
16/18/20/24/28
20/24/28
8/14/16/20/24/28/38
48/56

Bill of Material

  SOIC
Leadframe CDA 194
Die Attach Conductive Epoxy - 84-1 LMI-SR4
Wire Bond 1.0 / 1.3 mils gold wire
Mold Compound Sumitomo 6600 Series
G600 Series (Green)
Lead Finish Solder Plate or 100% matteTin
Marking Top - Ink/Laser     ||    Bottom - Laser
Packing Antistatic Tubes/Plugs
Process Flow Carsem (M) Carsem (S)
CFC-SOIC-8LDMAT CFCS-SOIC
CFC-SOICWB-MAT
CFC-SOICNB-MAT
JEDEC Reference MS-012 (150 mils)
MS-013 (300 mils)
  SSOP(5.3mm) QSOP
Leadframe CDA 194
Die Attach Conductive Epoxy - 84-1 LMI-SR4
Wire Bond 1.0 / 1.3 mils gold wire
Mold Compound Shinetsu KMC 184
G700 Series (Green)		 Sumitomo 6600 Series
G600 Series (Green)
Lead Finish Solder Plate or 100% matteTin
Marking Top - Ink/Laser     ||     Bottom - Laser
Packing Antistatic Tubes/Plugs
Process Flow CFCS-5.3MM SSOP-NBM Csm(M) : CFCM-QSOP
Csm(S) : CFCS-QSOP-NBM
JEDEC Reference MO-150 MO-137 (150 mils)
N/A (300 mils)
. TSSOP(4.4 & 6.1mm) MSOP(3.0mm)
Leadframe CDA 7025 CDA 194
Die Attach Conductive Epoxy - 84-1 LMI-SR4
Wire Bond 1.0 / 1.3 mils gold wire
Mold Compound Sumitomo 7351 Series
G700 Series (Green)		 Sumitomo 6600 Series
Lead Finish Solder Plate or 100% matteTin
Marking Top - Ink/Laser     ||     Bottom - Laser
Packing Antistatic Tubes/Plugs
Process Flow CFCS-TSSOP-NBM CFCM-MSOP-STD
JEDEC Reference MO-153 MO-187

Package Performance

Reliability Data

Reference Specifications
Mil Standard 883 for Test Method and Procedures
J-STD-20A method A112 for Moisture Sensitivity
J-STD-20A method A113 for Preconditioning

Stress Conditions
Autoclave 1008 hours 121°C / 100% RH, 2 atm
Temp. Cycle 1000 cycles -65°C / +150°C
Thermal Shock 300 cycles -55°C / +125°C
 
Reliability & MSL Results
Please Contact Sales Office for Package Specific Results
Thermal Data
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Electrical Data
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Datasheet & Drawings

Datasheet

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Drawings
CLICK to view Package Outline
SOIC - 150 mils QSOP - 150 mils / Matrix
SOIC - 300 mils QSOP - 300 mils
SSOP MSOP - 8 / 10 L 8L EP
TSSOP