Sip:
Carsem's SiP(System in Package) is the advanced technology of placing multiple ICs and passive components into a single package. We are one of the world's leading manufacturers of SiP modules and our services include design, modeling as well as final test including RF testing of Bluetooth and WLAN applications.

Features :

• Package size from 3x3 mm to 30x30 mm
• Pitches as small as 0.5mm
• Thickness from 0.5 mm to 2.0 mm.
• Glob top plus dam & fill options
• Any combination of flip chip, wire bond and stacked die
• Laser trim while testing.
• Ability to mount an MLP inside the SiP
• Passive as small as 0201

Applications :

There is an almost endless list of potential SiP applications and some examples are :

• BluetoothTM Wireless Devices
• 802.11 WLAN Applications
• Power Management Devices
• GPS Modules
• Internet Mini-Systems