Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world. Founded in 1972, Carsem is among the most experienced companies in our industry. Our motto, Your Technology Partner, reflects our strong belief that one of the key values in providing advanced technology and services is to establish a long-term partner relationship with our customers. The entire Carsem team is dedicated to supporting that belief.

Package:
Carsem offers one of the widest ranges of package portfolios in the industry. Our package families include MLP, SiP/Array, QFP, SOPs, Micro, Power, PLCC and PDIP. For a detailed summary see our Packaging Availability Datasheet.

Test:
Carsem offers a full range of turn-key test solutions and services for RF, mixed-signal, analog, digital and power devices. We currently test over 65% of the total units we assemble, which is one of the highest percentages in the industry. The test services include wafer probe, final test, product engineering and complete test program/hardware development.

Process:
Carsem offers SiP (System in Package), and our patented FCOL™ (Flip Chip On Leadframe) process technology for various package types. We also offer COL (Chip On Lead), which involves attaching a die directly to the leadframe fingers, for various standard package configurations. In addition Carsem offers a "green" solution for the majority of our package portfolio.