QFP PACKAGES

Carsem offers a wide variety of JEDEC compliant QFP (Quad Flat Package) leaded packages for medium to high pin count IC's. The MQFP is available in body sizes ranging from 10 x 10mm to 14 x 20mm with lead counts from 24 to 100. The LQFP is a family of 1.4mm thick packages with body sizes ranging from 7 x 7mm to 10 x 10mm and lead counts from 32 to 64.

Availability

MQFP (Metric Quad Flat Pack Package)

Body (mm)
10 x 10
14 x 20
 Lead Count
44/52
64/80/100/128

LQFP (1.4mm) (Low Quad Flat Pack Package)

Body (mm)
7 x 7
10 x 10
 Lead Count
32/48
44/52/64

Bill of Material

  MQFP LQFP/TQFP
Leadframe C7025 / KLF125 / EFTEC64T
Die Attach 84-1 LMI-SR4/SNB
Wire Bond 1.0 / 1.2 / 1.3mils gold wire
Mold Compound Sumitomo 6650* Series
G600 Series (Green)		 Sumitomo 7351 Series
G700 Series (Green)
Lead Finish Solder Plate or 100% matte Tin
Marking Laser
Packing (JEDEC Trays) Bakeable - Thin Profile
Non-bakeable - Thin Profile
Process Flow CFC-QFP-LTM-NSD (Dry Pack) CFC-QFP-NSD-DP (Dry Pack)
CFC-QFP-LTM (No Dry Pack) CFC-QFP-NSD-NDP (No Dry Pack)
JEDEC Reference MS-022 3.2mm Footprint
MO-112 3.9mm Footprint
MO-143 2.6mm Footprint		 MS-026 2.0mm Footprint

Package Performance

Reliability Data

Reference Specifications
Mil Standard 883 for Test Method and Procedures
J-STD-20A method A112 for Moisture Sensitivity
J-STD-20A method A113 for Preconditioning

Stress Conditions
Autoclave 1008 hours 121°C / 100% RH, 2 atm
Temp. Cycle 1000 cycles -65°C / +150°C
Thermal Shock 300 cycles -55°C / +125°C
 
Reliability & MSL Results
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Thermal Data
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Electrical Data
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Datasheet & Drawings

Datasheet

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Drawings
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MQFP LQFP