POWER PACKAGES

Carsem offers a wide variety of surface mountable and thermally enhanced packages for power management IC's and power devices.

Availability

SOT223 : Small Outline Transistor
TO220 : Transistor Outline
DDPAK : Transistor Outline (TO-263)
Package Type
DDPAK
SOT223
TO220
 Lead Count
3/5/7
4
3/5/7

Bill of Material

Lead
Count		 Leadframe
Material		 Die Attach Wire
Size		 Mold
Compound		 Marking Top Bottom Row Character
SOT223 HCL-12S Epoxy 84-1
LMISR4		 1.0
1.3
1.5
2.0
Mil		 Shinetsu
KMC 175
Series /
GE7470L-32
(Green)		 Laser Yes Yes 2 6
Soft Solder
95Pb/5Sn
Eutectic AuSn
TO220
3/5/7L		 HCL-12S Epoxy 84-1
LMISR4		 1.3
1.5
2.0
3.0
Mil		 Nitto MP8000
Series /
CEL9240HF10
(Green)		 Pad Mark
White
Ink /
Laser		 Yes No 3 9
DDPAK
3/5/7L		 Soft Solder
95Pb/5Sn

Package Performance

Reliability Data

Reference Specifications
Mil Standard 883 for Test Method and Procedures
J-STD-20A method A112 for Moisture Sensitivity
J-STD-20A method A113 for Preconditioning

Stress Conditions
Autoclave 1008 hours 121°C / 100% RH, 2 atm
Temp. Cycle 1000 cycles -65°C / +150°C
Thermal Shock 300 cycles -55°C / +125°C
 
Reliability & MSL Results
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Thermal Data
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Electrical Data
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Datasheet & Drawings

Datasheet

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Drawings
CLICK lead count to view Package Outline
SOT223 - 4 L DDPAK - 3 / 5 / 7 L
TO220 - 3 / 5 / 7 L