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Carsem offers a variety of JEDEC compliant PLCC (Plastic
Leaded Chip Carrier) packages with "J-Bend" leads for various
IC applications. The standard square versions have lead counts
of 28 and 44.
| PLCC |
: Plastic Leaded Chip Carrier |
Package Type
Square
Rectangle
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Lead Count
28/44
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| Leadframe |
CDA 151 |
| Die Attach |
Conductive Epoxy - 84-1 LMI-SR4 |
| Wire Bond |
1.0 to 1.3 mil gold wire |
| Mold Compound |
Sumitomo 6300 Series / G600 Series
(Green) |
| Lead Finish |
Solder Plate or 100% matte Tin |
| Marking |
Top - Ink/Laser || Bottom - Laser |
| Packing |
Antistatic Tubes/Plugs |
Process Flow
(NBM-No Bottom Mark) |
Carsem(M) |
Carsem(S) |
| CFC-PLCC |
CFCS-PLCC-NBM |
| JEDEC Reference |
MS-018 (Square Packages) |
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| Reliability Data |
Reference Specifications |
 Mil Standard 883 for Test Method and Procedures |
| J-STD-20A method A112 for Moisture Sensitivity |
| J-STD-20A method A113 for Preconditioning |
Stress Conditions |
| Autoclave |
1008 hours |
121°C / 100% RH, 2 atm |
| Temp. Cycle |
1000 cycles |
-65°C / +150°C |
| Thermal Shock |
300 cycles |
-55°C / +125°C |
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| Reliability & MSL Results |
| Please Contact Sales Office for Package Specific Results |
| Thermal Data |
| Please CLICK to view |
| Electrical Data |
| Please CLICK to view |
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| Datasheet |
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Please contact Sales Office
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| Drawings |
| CLICK to view Package Outline |
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