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Carsem offers a variety of JEDEC compliant PDIP's (Plastic Dual-In-Line
Package) for various IC applications. The 300 mils wide versions include
8, 14 and 16 lead options.
| PDIP |
: Plastic Dual-In-Line Package |
Package Type
300 mils
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Lead Count
8/14/16
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| Leadframe |
CDA 194 |
| Die Attach |
Conductive Epoxy - 84-1 LMI-SR4 |
| Wire Bond |
1.0 to 1.3 mil gold wire |
| Mold Compound |
Sumitomo 6300 Series / G600 Seies
(Green) |
| Lead Finish |
Solder Plate or 100% matte Tin |
| Marking |
Top - Ink/Laser || Bottom - Laser |
| Packing |
Antistatic Tubes/Pins |
Process Flow
(NBM-No Bottom Mark) |
Carsem(M) |
Carsem(S) |
| CFCM-PDIP-PLATE |
CFCS-PDIP-NBM |
| JEDEC Reference |
MS-001 (300 mils)
MS-011 (600 mils) |
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| Reliability Data |
Reference Specifications |
 Mil Standard 883 for Test Method and Procedures |
| J-STD-20A method A112 for Moisture Sensitivity |
| J-STD-20A method A113 for Preconditioning |
Stress Conditions |
| Autoclave |
1008 hours |
121°C / 100% RH, 2 atm |
| Temp. Cycle |
1000 cycles |
-65°C / +150°C |
| Thermal Shock |
300 cycles |
-55°C / +125°C |
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| Reliability & MSL Results |
| Please Contact Sales Office for Package Specific Results |
| Thermal Data |
| Please CLICK to view |
| Electrical Data |
| Please CLICK to view |
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| Datasheet |
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Please contact Sales Office
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| Drawings |
| CLICK to view Package Outline |
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