Carsem's MLP (Micro Leadframe Package) is a family of JEDEC compliant QFN plastic packages. This near CSP package is available in three versions. The Quad (MLPQ) has 4 sides of I/Os with a body size range of 3x3mm with 8 I/Os to 9x9mm with 64 I/Os and body thickness options of 0.9mm, 0.75mm, plus the Ultra-Thin that is only 0.5mm thick. The Micro (MLPM) has 2 sides of I/Os with a body size range of 2x2mm with 3 I/Os to 3x3mm with 10 I/Os and a thickness of 0.9mm. The Dual (MLPD) versions are designed to provide a foot print compatible replacement for SOIC, SSOP, TSSOP and MSOP packages. MLP'S typically have an exposed die attach pad for improved thermal performance. However, we also offer non-exposed pad options for COL (Chip On Lead), FCOL™ and other special applications. Custom versions with leads fused to the die attach pad and dual die attach pads can also be provided. We also offer a full range of turnkey test solutions and services for RF, mixed-signal, analog, digital and power devices.
Availability
MLP Quad/Dual
| Body (mm) 3 x 3 3.5 x 3.5 4 x 3.5 4 x 4 4.5 x 3.5 5 x 4 5 x 5 5 x 7 6 x 5 6 x 6 7 x 5 7 x 7 8 x 8 9 x 9 3 x 3 (Dual) 4 x 3 (Dual) 5 x 6 (Dual) |
Lead Count 8/12/16 14 16 12/16/20/24 20 24 14/20/28/32 38 32 28/36/40 38 32/44/48 56 64 6/8/10 12 8(SOIC)/18 |
Custom sizes are also available upon request.
MLP Micro
| Body (mm) 2 x 2 3 x 2 3 x 3 |
Lead Count 3/4/5/6/8 3/4/5/6/8 3/4/5/6/8/10 |
Bill of Material
| MLPM-EP | MLPM-COL | MLPM-FCOL | |
| Leadframe | CDA 194 | ||
| Die Attach | 84-1 LMI-SNB | ABLESTIK 8006 | N.A. |
| Wire Bond | 0.8/1.0/1.3/2.0 mil Au | N.A. | |
| Flipchip | N.A. | N.A. | Solder Paste |
| Mold Compound | Nitto MP8000 Series / G600 (Green) | ||
| Lead Finish | Solder Plate / Matte Tin Paste (Pb-free) | ||
| Marking | Laser | ||
| Download Marking Capability | |||
| Packing | Cannister (for untested packages) | ||
| Tape & Reel (for tested packages) | |||
| Process Flow | CFCM-MLP-EP | CFCM-MLP-COL | N.A. |
| JEDEC Reference | MO-229 | ||
| MLPQ/D - EP | MLPQ/D - COL | MLPQ/D - FCOL | |
| Leadframe | CDA 194 | ||
| Die Attach | Sumitomo 1076DJ/QMI 519 | ABLESTIK 8006 | N.A. |
| Wire Bond | 0.8/1.0/1.3/2.0 mil Au | N.A. | |
| Mold Compound | Sumitomo 7730LF / G770H (Green) | ||
| Lead Finish | Solder Plate / Matte Tin Paste (Pb-free) | ||
| Marking | Laser | ||
| Download Marking Capability | |||
| Packing | Cannister, Tube & Tray (for untested packages) | ||
| Tape & Reel (for tested packages) | |||
| Process Flow | CFCM-MLP | N.A. | CFCM-FC-MLP |
| JEDEC Reference | MLPQ : MO-220 / MLPD : MO-229 | ||
Package Performance
| Reliability Data | ||||||||||||
Reference Specifications |
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 Mil Standard 883 for Test Method and Procedures |
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| J-STD-20A method A112 for Moisture Sensitivity |
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| J-STD-20A method A113 for Preconditioning |
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| IPC-SM-785 for Board Level Reliability |
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Stress Conditions |
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| Reliability & MSL Results | ||||||||||||
| Please Contact Sales Office for Package Specific Results | ||||||||||||
| Thermal Data | ||||||||||||
| Please CLICK to view | ||||||||||||
| Electrical Data | ||||||||||||
| Please CLICK to view |
Datasheet & Drawings
| Datasheet | ||||||||||||||||||
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CLICK to view MLP Datasheet |
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| Drawings | ||||||||||||||||||
| CLICK to view Package Outline | ||||||||||||||||||
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