Carsem offers a wide selection of SSBGA (Small Scale Ball Grid Array)packages using Organic (Bisaleimide-Trizine and FR4), Flex-Tape(Polyimide) and Ceramic substrates in both Ball Grid and Land Grid formats. Body sizes range from 4x4mm to 17x17mm with ball/land pitch options from 0.50mm to 1.0mm. Ball Grid arrays are available thickness between 1.0mm to 1.7mm using both wire bond and flip chip interconnect. Our array services include design, modeling as well as providing a full range of turnkey test services for RF, mixed-signal, analog and digital devices.

Availability

Array options in SSBGA (Organic-BT), SSLGA (Organic),FTBGA (Flex Tape) and CBGA (Ceramic) are available with various I/O counts in body sizes from 4x4 to 17x17 mm, and pitches from 0.5 to 1.0 mm using wire bond or flip-chip.

Wire Bond

Typical Options Typical Dimensions Pitch (mm) Body Sizes (mm) Ball-I/O Count A = 1.0mm to 1.70mm B = 0.30mm to 0.55mm C = 4.0mils to 8.0mils D = min. 0.60mm E = 0.5mm to 1.0mm F = 6.0mm to 12.0mm 1 9x9 to 17x17 64 to 256 0.8 4x4 to 17x17 16 to 256     0.5 5x5 to 8x8 40 to 108

Flip Chip

Stacked Die

Bill of Material

Package Performance

Reliability Data Reference Specifications Mil Standard 883 for Test Method and Procedures J-STD-20A method A112 for Moisture Sensitivity J-STD-20A method A113 for Preconditioning IPC-SM-785 for Board Level Reliability Stress Conditions Autoclave 1008 hours 121°C / 100% RH, 2 atm Temp. Cycle 1000 cycles -65°C / +150°C Thermal Shock 300 cycles -55°C / +125°C Board Stress 2000 cycles -40°C / +100°C   Reliability & MSL Results Please Contact Sales Office for Package Specific Results Thermal Data Please CLICK to view Electrical Data Please CLICK to view

Datasheet & Drawings

Datasheet Please contact Sales Office Drawings SSBGA FTBGA SSLGA CLICK to View Please contact Sales Office Please contact Sales Office CBGA     Please contact Sales Office