Carsem offers a wide variety of surface mountable and thermally enhanced packages for power management IC's and power devices.

Availability	Bill of Material	Package Performance	Datasheet/Drawings
Lead Count Leadframe Material Die Attach Wire Size Mold Compound Marking Top Bottom Row Character SOT223 4L HCL-12S Epoxy 84-1 LMISR4 1.0 1.3 1.5 2.0 Mil Shinetsu KMC 175 Series / GE7470L-32 (Green) Laser Yes Yes 2 6 Soft Solder 95Pb/5Sn Eutectic AuSn TO220 3/5/7L HCL-12S Epoxy 84-1 LMISR4 1.3 1.5 2.0 3.0 Mil Nitto MP8000 Series / CEL9240HF10 (Green) Pad Mark White Ink / Laser Yes No 3 9 DDPAK 3/5/7L Soft Solder 95Pb/5Sn