Carsem offers a variety of JEDEC compliant PLCC (Plastic Leaded Chip Carrier) packages with "J-Bend" leads for various IC applications. The standard square versions have lead counts of 28 and 44.

Availability	Bill of Material	Package Performance	Datasheet/Drawings
Leadframe CDA 151 Die Attach Conductive Epoxy - 84-1 LMI-SR4 Wire Bond 1.0 to 1.3 mil gold wire Mold Compound Sumitomo 6300 Series / G600 Series (Green) Lead Finish Solder Plate or 100% matte Tin Marking Top - Ink/Laser || Bottom - Laser Packing Antistatic Tubes/Plugs Process Flow (NBM-No Bottom Mark) Carsem(M) Carsem(S) CFC-PLCC CFCS-PLCC-NBM JEDEC Reference MS-018 (Square Packages)