Carsem offers a variety of JEDEC compliant PDIP's (Plastic Dual-In-Line Package) for various IC applications. The 300 mils wide versions include 8, 14 and 16 lead options.

Availability	Bill of Material	Package Performance	Datasheet/Drawings
Leadframe CDA 194 Die Attach Conductive Epoxy - 84-1 LMI-SR4 Wire Bond 1.0 to 1.3 mil gold wire Mold Compound Sumitomo 6300 Series / G600 Series (Green) Lead Finish Solder Plate or 100% matte Tin Marking Top - Ink/Laser || Bottom - Laser Packing Antistatic Tubes/Pins Process Flow (NBM-No Bottom Mark) Carsem(M) Carsem(S) CFCM-PDIP-PLATE CFCS-PDIP-NBM JEDEC Reference MS-001 (300 mils) MS-011 (600 mils)