Carsem's MLP (Micro Leadframe Package) is a family of JEDEC compliant QFN plastic packages. This near CSP package is available in three versions. The Quad (MLPQ) has 4 sides of I/Os with a body size range of 3x3mm with 8 I/Os to 9x9mm with 64 I/Os and body thickness options of 0.9mm, 0.75mm, plus the Ultra-Thin that is only 0.5mm thick. The Micro (MLPM) has 2 sides of I/Os with a body size range of 2x2mm with 3 I/Os to 3x3mm with 10 I/Os and a thickness of 0.9mm. The Dual (MLPD) versions are designed to provide a foot print compatible replacement for SOIC, SSOP, TSSOP and MSOP packages. MLP'S typically have an exposed die attach pad for improved thermal performance. However, we also offer non-exposed pad options for COL (Chip On Lead), FCOL™ and other special applications. Custom versions with leads fused to the die attach pad and dual die attach pads can also be provided. We also offer a full range of turnkey test solutions and services for RF, mixed-signal, analog, digital and power devices.

Availability	Bill of Material	Package Performance	Datasheet/Drawings
Reliability Data Reference Specifications Mil Standard 883 for Test Method and Procedures J-STD-20A method A112 for Moisture Sensitivity J-STD-20A method A113 for Preconditioning IPC-SM-785 for Board Level Reliability Stress Conditions Autoclave 1008 hours 121°C / 100% RH, 2 atm Temp. Cycle 1000 cycles -65°C / +150°C Thermal Shock 300 cycles -55°C / +125°C Board Stress 2000 cycles -40°C / +100°C   Reliability & MSL Results Please Contact Sales Office for Package Specific Results Thermal Data Please CLICK to view Electrical Data Please CLICK to view