Carsem's MLP (Micro Leadframe Package) is a family of JEDEC
compliant QFN plastic packages. This near CSP package is available
in three versions. The Quad (MLPQ) has 4 sides of I/Os with
a body size range of 3x3mm with 8 I/Os to 9x9mm with 64 I/Os
and body thickness options of 0.9mm, 0.75mm, plus the Ultra-Thin
that is only 0.5mm thick. The Micro (MLPM) has 2 sides of
I/Os with a body size range of 2x2mm with 3 I/Os to 3x3mm
with 10 I/Os and a thickness of 0.9mm. The Dual (MLPD) versions
are designed to provide a foot print compatible replacement
for SOIC, SSOP, TSSOP and MSOP packages. MLP'S typically have
an exposed die attach pad for improved thermal performance.
However, we also offer non-exposed pad options for COL (Chip
On Lead), FCOL™ and other special applications. Custom
versions with leads fused to the die attach pad and dual die
attach pads can also be provided. We also offer a full range
of turnkey test solutions and services for RF, mixed-signal,
analog, digital and power devices.
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