Carsem's MLP (Micro Leadframe Package) is a family of JEDEC compliant QFN plastic packages. This near CSP package is available in three versions. The Quad (MLPQ) has 4 sides of I/Os with a body size range of 3x3mm with 8 I/Os to 9x9mm with 64 I/Os and body thickness options of 0.9mm, 0.75mm, plus the Ultra-Thin that is only 0.5mm thick. The Micro (MLPM) has 2 sides of I/Os with a body size range of 2x2mm with 3 I/Os to 3x3mm with 10 I/Os and a thickness of 0.9mm. The Dual (MLPD) versions are designed to provide a foot print compatible replacement for SOIC, SSOP, TSSOP and MSOP packages. MLP'S typically have an exposed die attach pad for improved thermal performance. However, we also offer non-exposed pad options for COL (Chip On Lead), FCOL™ and other special applications. Custom versions with leads fused to the die attach pad and dual die attach pads can also be provided. We also offer a full range of turnkey test solutions and services for RF, mixed-signal, analog, digital and power devices.

Availability	Bill of Material	Package Performance	Datasheet/Drawings
MLPM-EP MLPM-COL MLPM-FCOL Leadframe CDA 194 Die Attach 84-1 LMI-SNB ABLESTIK 8006 N.A. Wire Bond 0.8/1.0/1.3/2.0 mil Au N.A. Flipchip N.A. N.A. Solder Paste Mold Compound Nitto MP8000 Series / G600 (Green) Lead Finish Solder Plate / Matte Tin Paste (Pb-free) Marking Laser Download Marking Capability Packing Cannister (for untested packages) Tape & Reel (for tested packages) Process Flow CFCM-MLP-EP CFCM-MLP-COL N.A. JEDEC Reference MO-229   MLPQ/D - EP MLPQ/D - COL MLPQ/D - FCOL Leadframe CDA 194 Die Attach Sumitomo 1076DJ/QMI 519 ABLESTIK 8006 N.A. Wire Bond 0.8/1.0/1.3/2.0 mil Au N.A. Mold Compound Sumitomo 7730LF / G770H (Green) Lead Finish Solder Plate / Matte Tin Paste (Pb-free) Marking Laser Download Marking Capability Packing Cannister, Tube & Tray (for untested packages) Tape & Reel (for tested packages) Process Flow CFCM-MLP N.A. CFCM-FC-MLP JEDEC Reference MLPQ : MO-220 / MLPD : MO-229