Carsem offers a wide variety of lower lead count industry standard packages for the manufacturers of Micro IC's and components. Packages range from the very small 3 lead SC70 to the larger 8 lead SOT23. The TSOT package is a thinner version (1.0mm) of the SOT23 (1.45mm). The 6 lead SOT66x offers a very small footprint, 1.66mm long by 1.66mm wide (lead tip to lead tip) and has a max thickness of 0.6mm. It is available in both a COL (Chip On Lead) and an exposed die pad version.

Availability	Bill of Material	Package Performance	Datasheet/Drawings
Reliability Data Reference Specifications Mil Standard 883 for Test Method and Procedures J-STD-20A method A112 for Moisture Sensitivity J-STD-20A method A113 for Preconditioning Stress Conditions Autoclave 1008 hours 121°C / 100% RH, 2 atm Temp. Cycle 1000 cycles -65°C / +150°C Thermal Shock 300 cycles -55°C / +125°C   Reliability & MSL Results Please Contact Sales Office for Package Specific Results Thermal Data Please CLICK to view Electrical Data Please CLICK to view