Carsem offers a wide variety of lower lead count industry standard packages for the manufacturers of Micro IC's and components. Packages range from the very small 2 lead SC79 to the larger 8 lead SOT23. The TSOT package is a thinner version (1.0mm) of the SOT23 (1.45mm). The 6 lead SOT66x offers a very small footprint, 1.66mm long by 1.66mm wide (lead tip to lead tip) and has a max thickness of 0.6mm. It is available in both a COL (Chip On Lead) and an exposed die pad version.

Availability	Bill of Material	Package Performance	Datasheet/Drawings
Datasheet Please contact Sales Office Drawings CLICK lead count to view Package Outline SOT23 - 3 / 5 / 6 / 8 L SC79 - 2 L TSOT - 5 / 6 / 8 L SOD323 - 2 L SOT23 - 3 / 5 / 6 / 8 L SOT66x - EP 6 L SOT143 - 4 L SOT66x - COL 5 / 6 L