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printable page MICRO PACKAGES

Carsem offers a wide variety of lower lead count industry standard packages for the manufacturers of Micro IC's and components. Packages range from the very small 2 lead SC79 to the larger 8 lead SOT23. The TSOT package is a thinner version (1.0mm) of the SOT23 (1.45mm). The 6 lead SOT66x offers a very small footprint, 1.66mm long by 1.66mm wide (lead tip to lead tip) and has a max thickness of 0.6mm. It is available in both a COL (Chip On Lead) and an exposed die pad version.

Availability Bill of Material Package Performance Datasheet/Drawings
SOT66x : Small Outline Transistor
SC70 : Shrink SOT Package
SC79 : Shrink SOD Package
SOT23 : Small Outline Transistor
SOT143 : Small Outline Transistor
TSOT : Thin Small Outline Transistor
SOD323 : Small Outline Diode
Package Type
SOT66x
*SC70
SC79
SOT23
SOT143
TSOT
SOD323
Lead Count
5/6
3/4/5/6
2
3/5/6/8
4
5/6/8
2

* Also referred to as SOT323

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