FCOL™ :

Carsem's patent pending FCOLTM (Flip Chip On Leadframe) is the process of flipping a bumped die with pad pitches as small as 8 mils (200 microns) onto a lead frame and then molding it using standard plastic package assembly process. FCOL™ is available in standard packages such as MLP, SOT23, SC70, TSOT, QSOP and narrow body SOICs.

Features :

• Same package with up to 4X larger die
• MSL Level 1*
• 60% improvement in self-inductance and capacitance
• 15% lower thermal resistance
• 30x reduction in resistance vs wire bond
• Withstands 260oC solder shock test
• Ability to final test including RF

Applications :

There are a wide range of applications for FCOL and some examples are :

• Wireless Devices
• Power Management Devices
• High-speed Network Devices