Carsem offers a wide selection of SSBGA (Small Scale Ball Grid Array)packages using Organic (Bisaleimide-Trizine and FR4), Flex-Tape(Polyimide) and Ceramic substrates in both Ball Grid and Land Grid formats. Body sizes range from 4x4mm to 17x17mm with ball/land pitch options from 0.50mm to 1.0mm. Ball Grid arrays are available thickness between 1.0mm to 1.7mm using both wire bond and flip chip interconnect. Our array services include design, modeling as well as providing a full range of turnkey test services for RF, mixed-signal, analog and digital devices.

Availability	Bill of Material	Package Performance	Datasheet/Drawings
Reliability Data Reference Specifications Mil Standard 883 for Test Method and Procedures J-STD-20A method A112 for Moisture Sensitivity J-STD-20A method A113 for Preconditioning IPC-SM-785 for Board Level Reliability Stress Conditions Autoclave 1008 hours 121°C / 100% RH, 2 atm Temp. Cycle 1000 cycles -65°C / +150°C Thermal Shock 300 cycles -55°C / +125°C Board Stress 2000 cycles -40°C / +100°C   Reliability & MSL Results Please Contact Sales Office for Package Specific Results Thermal Data Please CLICK to view Electrical Data Please CLICK to view