Carsem offers a wide selection of SSBGA (Small Scale Ball Grid Array)packages using Organic (Bisaleimide-Trizine and FR4), Flex-Tape(Polyimide) and Ceramic substrates in both Ball Grid and Land Grid formats. Body sizes range from 4x4mm to 17x17mm with ball/land pitch options from 0.50mm to 1.0mm. Ball Grid arrays are available thickness between 1.0mm to 1.7mm using both wire bond and flip chip interconnect. Our array services include design, modeling as well as providing a full range of turnkey test services for RF, mixed-signal, analog and digital devices.

Availability	Bill of Material	Package Performance	Datasheet/Drawings
SSBGA FTBGA SSLGA CBGA Substrate Organic Polymide Organic Ceramic Die Attach QMI 526 QMI 526 QMI 526 QMI 519 / KCDAH001 Wire Bond 1.0 to 1.3 mils gold wire 1.0, 1.3, 2.0 mils gold wire Lead Finish 18 mils Solder Spheres; Sn63 / Pb37 Not Applicable 18 mils Solder Spheres; Sn63 / Pb37 Marking TOP - Laser Ink Packing (JEDEC Trays) Bakeble-Thin Profile (Drybaking) & Non-Bakeable-Thin Profile (Standard) Flow CFCA-SSBGA CFCA-FTBGA CFCA-SSLGA CFCA-CBGA JEDEC Reference MO205 Various MO222 MO205