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printable page ARRAY PACKAGES

Carsem offers a wide selection of SSBGA (Small Scale Ball Grid Array)packages using Organic (Bisaleimide-Trizine and FR4), Flex-Tape(Polyimide) and Ceramic substrates in both Ball Grid and Land Grid formats. Body sizes range from 4x4mm to 17x17mm with ball/land pitch options from 0.50mm to 1.0mm. Ball Grid arrays are available thickness between 1.0mm to 1.7mm using both wire bond and flip chip interconnect. Our array services include design, modeling as well as providing a full range of turnkey test services for RF, mixed-signal, analog and digital devices.

Availability Bill of Material Package Performance Datasheet/Drawings

 

 

SSBGA : Wire Bond
SSBGA-FC : Flip Chip
SDBGA : Stacked Die

CLICK on the above for more detail.

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