Carsem offers a wide selection of SSBGA (Small Scale Ball Grid Array)packages using Organic (Bisaleimide-Trizine and FR4), Flex-Tape(Polyimide) and Ceramic substrates in both Ball Grid and Land Grid formats. Body sizes range from 4x4mm to 17x17mm with ball/land pitch options from 0.50mm to 1.0mm. Ball Grid arrays are available thickness between 1.0mm to 1.7mm using both wire bond and flip chip interconnect. Our array services include design, modeling as well as providing a full range of turnkey test services for RF, mixed-signal, analog and digital devices.

Availability	Bill of Material	Package Performance	Datasheet/Drawings

Array options in SSBGA (Organic-BT), SSLGA (Organic),FTBGA (Flex Tape) and CBGA (Ceramic) are available with various I/O counts in body sizes from 4x4 to 17x17 mm, and pitches from 0.5 to 1.0 mm using wire bond or flip-chip.

Wire Bond

Typical Options Typical Dimensions Pitch (mm) Body Sizes (mm) Ball-I/O Count A = 1.0mm to 1.70mm B = 0.30mm to 0.55mm C = 4.0mils to 8.0mils D = min. 0.60mm E = 0.5mm to 1.0mm F = 6.0mm to 12.0mm 1 9x9 to 17x17 64 to 256 0.8 4x4 to 17x17 16 to 256     0.5 5x5 to 8x8 40 to 108

Flip Chip

Stacked Die