Carsem Receives Allegro Supplier Excellence Award

April 11th, 2012

Ipoh, Malaysia – April 11, 2012

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that it has received a 2011 Supplier Excellence Award from Allegro MicroSystems, Inc. for assembly and test services that were provided by the Carsem factory located in Suzhou, China. Read the rest of this entry »

Carsem Announces Manufacturing Capability Into Led Solutions

April 11th, 2012

Ipoh, Malaysia April 11th, 2012

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they are now entering a partnership with a key customer to assemble and further develop LED packaging technologies. Read the rest of this entry »

Software Engineers

March 23rd, 2012

Description:  This position is to develop MES system in meeting business requirement.

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Production Control Assistant

March 21st, 2012

Description-This job is respoonsible for monitoring the movement of work in progress and expedite materials to be shipped on time to assigned customers - 2 vacancies available.

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E&Q Staff

March 20th, 2012

Description- This job is responsible for monitoring and expediting lots for schedule and maximize daily input according to machine utilization.

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Flooding in Thailand – No Impact on Carsem

October 31st, 2011

Ipoh, Malaysia – 31 October, 2011 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that although the tragic flooding in Thailand has seriously inpacted certain sectors of the Semiconductor Industry, there will be no impact or disruption to its factories.

In these times, continuity of supply is an important consideration for Carsem customers. Carsem’s situation is as follows :

1. Carsem does not procure any direct or consumable material from Thailaind for its assembly and test.

2. The direct and consumable materials used in Carsem assembly and test are not manufactured in Thailand.

These 2 statements apply to ALL Carsem assembly and test facilities. thus, there will be no impact or disruption to its factories.

Carsem extends its thoughts and prayers to its Thai neigbours during these dire times.

Carsem Receives Exar’s Supplier of the Year Award

September 15th, 2011

Ipoh, Malaysia – 14 September, 2011 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received Exar Corporation’s FY2011 Supplier of The Year Award for assembly and test services that were provided by the Carsem factories located in Ipoh, Malaysia. The award is based several criteria including the quarterly scorecard performance, as well as effort and flexibility in terms of operations, quality, deliveries and cost indices.

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Carsem Receives Microsemi Corporation’s Best Supplier of the Year Award for 2010

June 22nd, 2011

Ipoh, Malaysia – 22 June, 2011 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that, for the second year in a row, it has received Microsemi Corporation’s Best Supplier of The Year Award for assembly and test services that were provided by the Carsem factory located in Suzhou, China. The award is based on Microsemi’s supplier program that measures key metrics such as, on-time delivery, yield, customer service, quality, competitiveness, responsiveness and technology. Read the rest of this entry »

Carsem Expanding Suzhou Factory MLP (QFN) Capacity

May 26th, 2011

Ipoh, Malaysia – 25 May, 2011.

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they are expanding their Suzhou, China factory size by an additional 40,000 square meters (430,000 square feet). The ground breaking for the new facility expansion commenced in Q1 2011 and production operations are expected to begin in Q1 2012. The expansion will bring the total factory size to 56,000 square meters (600,000 square feet) and will allow Carsem to increase their Suzhou factory Micro Leadframe Package (MLP) capacity from the current 5 million units per day to over 20 million per day. The new expansion will be used to meet the future needs of Carsem’s existing as well as new potential customers and will incorporate a major focus on copper wirebond expansion as well as the more traditional gold wirebond products.

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Carsem Receives Richtek’s 2010 Best Supplier Award

February 22nd, 2011

Ipoh, Malaysia – February 22, 2011 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received Richtek’s 2010 Best Supplier Award in recognition of outstanding services that were provided by the Carsem factory located in Suzhou, China. The award is based on Richtek’s exacting standards in the areas of quality and customer support.
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