Ipoh, Malaysia – August 24, 2010 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they are continuing to aggressively expand their MLP (QFN) manufacturing capacity in both their Ipoh, Malaysia and Suzhou, China factory locations and are now capable of producing over 11 million units per day. This capacity expansion in assembly is matched with an equal proportion of test capacity expansion.
Carsem Continues to Aggressively Expand MLP (QFN) Capacity
August 30th, 2010Carsem Wins ITC Patent Litigation Case
August 30th, 2010Ipoh, Malaysia – July 22, 2010 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it was determined by the International Trade Commission (ITC) that Carsem has not violated section 337 of the Tariff Act of 1930, 19 U.S.C. & 1377, in the on-going patent litigation with Amkor Technology regarding ITC’s Investigation No. 337-TA-501
Carsem Receives Supertex 2009 Excellence Award
August 30th, 2010Ipoh, Malaysia – June 22, 2010 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received a 2009 Supplier Excellence Award from Supertex, Inc. for assembly and test services that were provided by the Carsem factory located in Suzhou, China. The award is based on Supertex’s exacting standards in the areas of yield, quality and delivery performance.
Carsem Expands Extremely Thin MLP Capacity at Suzhou Factory
August 30th, 2010Ipoh, Malaysia – May 5, 2010-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they are significantly expanding their Suzhou, China factory’s manufacturing capacity for the new X3 package. The X3 is an extremely thin version of the MLP (Micro Leadframe Package) that is a two lead package with nominal dimensions of 0.6 mm long by 0.3 mm wide and 0.3 mm thick, which is very similar in size to a 0201 surface mount component.
Carsem Receives “No Violation” Decision in Patent Litigation Case
August 30th, 2010Ipoh, Malaysia – March 24, 2010-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that an Administrative Law Judge (ALJ) has issued a Supplemental Initial Determination (ID) in Carsem’s on-going patent litigation with Amkor Technology in the U.S. International Trade Commission (ITC) in Washington, D.C., ITC Investigation No. 337-TA-501
Account Manager – Carsem East Coast Office, Attleboro, MA
August 23rd, 2010Description:
As Account Manager you will, be responsible for sales development and technical engineering support for all essential sales activities. Primary responsibility for this position are preparation of quotes, forecasting sales, increasing / meeting sales goals, preparing monthly and quarterly reviews, and will be responsible to develop specific account strategies with direct customer and factory interface. Experience in sales along with technical engineering experience within a semiconductor, packaging and or subcontract foundry environment is preferred.
Responsibilities:
Responsible for all account activities including but not limited to, developing sales strategies that will maximize revenue, meet yearly sales goals and generate incremental revenues. Conduct meetings at all organizational levels that will drive new program opportunities through design, development and production phases. Must proactively develop strategies that result in new business opportunities and increase overall sales revenue. Have ability to develop strong customer relations at the appropriate decision making levels, gain knowledge of competitive issues to expand new business that create rapid sales growth opportunities, and conduct regular service and performance presentations.
Qualifications:
The successful candidate will possess a BSME, BSEE, or related degree and have 5-7 years of related semiconductor assembly/packaging experience. You will be highly organized, have sales experience and possess a strong technical background within the IC assembly semiconductor industry. This position requires some international travel. Additional skills would include proficiency in Microsoft Office; Excel, Word, and PowerPoint. Excellent written and verbal communication skills are necessary.
Carsem Receives Favorable Decision in Patent Litigation Case
February 19th, 2010Ipoh, Malaysia – February 19, 2010 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that the International Trade Commission (ITC) has issued a Notice of reversal and remand in Carsem’s on-going patent litigation with Amkor Technology, ITC case number 337-TA-501. Read the rest of this entry »
Carsem Receives Microsemi Corporation’s Best Supplier of the Year Award for 2009
February 4th, 2010Ipoh, Malaysia – February 4, 2010 – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received Microsemi Corporation’s Best Supplier of The Year Award for 2009 for assembly and test services that were provided by the Carsem factory located in Suzhou, China. The award is based on Microsemi’s supplier program that measures key metrics such as, on-time delivery, yield, customer service, quality, competitiveness, responsiveness and technology. Read the rest of this entry »
Carsem Receives The 2009 Award for Best External Manufacturing and Testing from Skyworks
January 27th, 2010Ipoh, Malaysia -January 27, 2010-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received the 2009 award for Best External Manufacturing and Testing from Skyworks Solutions, Inc., an innovator of high reliability analog and mixed signal semiconductors enabling a broad range of end markets. The award is based on quality, commercial and technological merit as it aligns with Skyworks’ supply chain requirements. Read the rest of this entry »
Carsem Remains Optimistic About ITC Patent Litigation
November 3rd, 2009Ipoh, Malaysia -November 3, 2009-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that an Administrative Law Judge (ALJ) has issued a supplemental Initial Determination (ID) in Carsem’s on-going patent litigation with Amkor Technology in the U.S. International Trade Commission (ITC) in Washington, D.C. Read the rest of this entry »