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POWER PACKAGES
Carsem offers a wide variety of surface mountable and thermally enhanced packages for power management IC's and power devices.
Availability
SOT223 |
: Small Outline Transistor |
TO220 |
: Transistor Outline |
DDPAK |
: Transistor Outline (TO-263) |
| Package Type |
Lead Count |
| DDPAK | 3/5/7 |
| SOT223 | 4 |
| TO220 | 3/5/7 |
Bill of Material
| Lead Count |
Leadframe Material |
Die Attach |
Wire Size |
Mold Compound |
Marking |
Top |
Bottom |
Row |
Character |
SOT223
3L |
HCL-12S |
Epoxy 84-1
LMISR4 |
1.0
1.3
1.5
2.0
Mil |
CEL9240HF10CT (Green) |
Laser |
Yes |
Yes |
2 |
7 |
Soft Solder
95Pb/
5Sn |
TO220
3/5/7L |
HCL-12S |
Epoxy 84-1
LMISR4 |
1.3
1.5
2.0
3.0
Mil |
CEL9240HF10 (Green) |
Laser |
Yes |
No |
3 |
9 |
DDPAK
3/5/7L |
Soft Solder
95Pb/
5Sn |
Package Performance
Reliability Data
| Reference Specifications |
| Mil Standard 883 for Test Method and Procedures |
| J-STD-20 Moisture/Reflow Sensitivity Classification |
| JESD 22- A113 for Preconditioning for Moisture / Reflow Sensitivity Classification |
| Stress Conditions |
| Autoclave |
96 hours |
121°C / 100% RH, 2 atm |
| Temp. Cycle |
200,500 cycles |
-65°C / +150°C |
| Thermal Shock |
N/A |
N/A |
Reliability & MSL Results
| Please Contact Sales Office for Package Specific Results |
Thermal Data
Electrical Data
Datasheet / Drawings
Datasheet
| Please contact Sales Office |
Drawings
| CLICK lead count to view Package Outline |
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