Power Packages

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Testing
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POWER PACKAGES
Carsem offers a wide variety of surface mountable and thermally enhanced packages for power management IC's and power devices.

Availability

SOT223
: Small Outline Transistor
TO220
: Transistor Outline
DDPAK
: Transistor Outline (TO-263)

Package Type Lead Count
DDPAK3/5/7
SOT2234
TO2203/5/7

Bill of Material

Lead Count Leadframe Material Die Attach Wire Size Mold Compound Marking Top Bottom Row Character
SOT223
3L
HCL-12S Epoxy 84-1
LMISR4
1.0
1.3
1.5
2.0
Mil
CEL9240HF10CT (Green) Laser Yes Yes 2 7
Soft Solder
95Pb/
5Sn
TO220
3/5/7L
HCL-12S Epoxy 84-1
LMISR4
1.3
1.5
2.0 
3.0
Mil
CEL9240HF10 (Green) Laser Yes No 3 9
DDPAK
3/5/7L
Soft Solder
95Pb/
5Sn

Package Performance

Reliability Data
Reference Specifications
Mil Standard 883 for Test Method and Procedures
J-STD-20 Moisture/Reflow Sensitivity Classification
JESD 22- A113 for Preconditioning for Moisture / Reflow Sensitivity Classification

Stress Conditions
Autoclave 96 hours 121°C / 100% RH, 2 atm
Temp. Cycle 200,500 cycles -65°C / +150°C
Thermal Shock N/A N/A

Reliability & MSL Results
Please Contact Sales Office for Package Specific Results

Thermal Data
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Electrical Data
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Datasheet / Drawings

Datasheet
Please contact Sales Office

Drawings
CLICK lead count to view Package Outline
SOT223 - 4 L
DDPAK - 3 / 5 / 7 L
TO220 - 3 / 5 / 7 L