PLCC Packages

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PLCC PACKAGES
Carsem offers JEDEC compliant PLCC (Plastic Leaded Chip Carrier) packages with "J-Bend" leads for various IC applications. The standard square versions have lead counts of 28 and 44.

Availability

PLCC
: Plastic Leaded Chip Carrier

Package Type Lead Count
Square28/44

Bill of Material

Leadframe CDA 151
Die Attach Conductive Epoxy - 84-1 LMI-SR4
Wire Bond 1.0 to 1.3 mil gold wire
Mold Compound Sumitomo 6650 Series / G600 Series (Green)
Lead Finish 100% matte Tin
Marking Top - Laser
Packing Antistatic Tubes/Pins
Process Flow Carsem(S)
CFCS-PLCC-NBM
JEDEC Reference MS-018

Package Performance

Reliability Data
Reference Specifications
Mil Standard 883 for Test Method and Procedures
J-STD-20 Moisture/Reflow Sensitivity Classification
JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification

Stress Conditions
Autoclave 1008 hours 121°C / 100% RH, 2 atm
Temp. Cycle 1000 cycles -65°C / +150°C
Thermal Shock 300 cycles -55°C / +125°C

Reliability & MSL Results
Please Contact Sales Office for Package Specific Results

Thermal Data
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Electrical Data
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Datasheet / Drawings

Datasheet
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Drawings
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PLCC - Square