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PLCC PACKAGES
Carsem offers JEDEC compliant PLCC (Plastic Leaded Chip Carrier) packages with "J-Bend" leads for various IC applications. The standard square versions have lead counts of 28 and 44.
Availability
PLCC |
: Plastic Leaded Chip Carrier |
| Package Type |
Lead Count |
| Square | 28/44 |
Bill of Material
| Leadframe |
CDA 151 |
| Die Attach |
Conductive Epoxy - 84-1 LMI-SR4 |
| Wire Bond |
1.0 to 1.3 mil gold wire |
| Mold Compound |
Sumitomo 6650 Series / G600 Series (Green) |
| Lead Finish |
100% matte Tin |
| Marking |
Top - Laser |
| Packing |
Antistatic Tubes/Pins |
| Process Flow |
Carsem(S) |
| CFCS-PLCC-NBM |
| JEDEC Reference |
MS-018 |
Package Performance
Reliability Data
| Reference Specifications |
| Mil Standard 883 for Test Method and Procedures |
| J-STD-20 Moisture/Reflow Sensitivity Classification |
| JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification |
| Stress Conditions |
| Autoclave |
1008 hours |
121°C / 100% RH, 2 atm |
| Temp. Cycle |
1000 cycles |
-65°C / +150°C |
| Thermal Shock |
300 cycles |
-55°C / +125°C |
Reliability & MSL Results
| Please Contact Sales Office for Package Specific Results |
Thermal Data
Electrical Data
Datasheet / Drawings
Datasheet
| Please contact Sales Office |
Drawings
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