Packaging

Packaging
 
 
 
 
 
 
 
 
Testing
Latest Technology Solutions
 

Carsem offers one of the widest ranges of package portfolios in the industry plus we provide a full range of turnkey test services for RF, mixed-signal, analog, digital and power devices. (For a detailed summary see our Packaging Availability Datasheet). Carsem also offers SiP (System in Package), and our patent pending FCOL™ (Flip Chip on Leadframe) process technology for various package types.