CARSEM RECEIVES 2008 SUPPLIER EXCELLENCE AWARD FROM TEXAS INSTRUMENTS

Ipoh, Malaysia June 19th, 2009

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they recently received a 2008 Supplier Excellence Award from Texas Instruments (TI). The award was based on Carsem's outstanding performance after TI's evaluation across key criteria including cost, environmental responsibility, technology, responsiveness, assurance of supply and quality.

The award was presented to Mr. Peter Yates, Carsem's Managing Director, during a ceremony held in early May at Carsem's headquarters located in Ipoh, Malaysia. The award was presented by Laura McLaughlin, TI's Director of Subcon Management, and was attended by several key TI employees involved in interfacing with semiconductor assembly and test service companies.

"TI's Supplier Excellence Award (SEA) recognizes suppliers who contribute significantly to our business success through outstanding performance and continuous improvement in providing goods and services," said McLaughlin. "Over the last three years, Carsem has undergone a systematic, focused approach in addressing quality and performance. The SEA is awarded to less than one percent of our supplier base and is a great recognition of the sustained performance that Carsem has made in supporting Texas Instruments.

"TI is clearly one of the top leaders in our industry and it is truly an honor to receive such a prestigious award. We are very proud of this achievement and look forward to our continued strong relationship with TI well into the future," said Mr. Yates.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.