CARSEM OFFERS STRIP TEST FOR SAWN MLP PACKAGES

Scotts Valley, CA -Dec 27, 2007, Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they now offer the ability to do strip testing of their Sawn Micro Leadframe Package (MLP) family using the TESEC 3270IH Film Frame Handler.

Film Frame Strip Test is a method of performing final electrical testing of devices while still in assembly matrix format mounted on tape. Individual units are uniquely identified with resulting test values in a software matrix map and then proceed to the next step in the manufacturing process while retaining traceability. Since the devices remain in matrix strip format, multiple devices can be tested simultaneously, thus improving throughput and greatly reducing the overall cost-of-test. Carsem has demonstrated up to octal-site testing on packages down to 2x2mm. This size package allows 3200 units to be tested on a single 8 inch film frame.

Allan Calamoneri, Carsem's Vice President of Test Business Development stated, "The capability to do Film Frame Strip Test of sawn packages removes the barriers to multi-site testing of packages smaller than 3x3mm, using a direct dock minimal-index-time approach. Using an internally developed set of criteria for choosing the most economic candidates for strip test, we have consistently seen significant improvements in UPH and a jump in OEE of approximately 10% over conventional test methods. We are very excited by the paradigm shift that Film Frame Strip Test offers to products that meet our set criteria."

Carsem MLP's are QFN (Quad Flat No-leaded) and SON (Small Outline No-lead) type packages that are complaint to JEDEC's MO220 and MO229 standards.

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About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.