HEADLINE NEWS
FOR IMMEDIATE RELEASE
Carsem, Inc.
Press Contact: Oliver Davis, Director of Marketing
Telephone Number: 831 438-6861
Fax Number: 831 438-6863
Email Address: odavis@carsem.com
Web site address: www.carsem.com

CARSEM ANNOUNCES APPOINTMENT OF CHIEF TECHNOLOGY OFFICER (CTO)

Scotts Valley, CA -June 25, 2007 Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today that Mr. Yong Lam Wai has joined the company as Chief Technology Officer (CTO), Packaging. Mr. Yong is based in Ipoh, Malaysia and reports to Mr. Dave Comley, Carsem's Group Managing Director.

Mr. Yong has over 25 years of experience in the technology sector of the semiconductor packaging industry, having spent time at Hitachi, Motorola, ST Micro, National Semiconductor and Amkor. Prior to joining Carsem he was General Manager of Finisar, Malaysia.

"I am impressed with the Carsem organization and the company's commitment to providing high quality products and services to our customers. I look forward to strengthening our product offerings and roadmaps moving forward", stated Mr. Yong.

Mr. Comley stated, "I am very pleased to have Lam Wai join the Carsem team. His industry and senior management experience will be key as we align our future product roadmaps with our customer's needs".

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About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.