CARSEM'S CHINA FACTORY ACHIEVES ISO/TS 16949 CERTIFICATION

Scotts Valley, CA January 24, 2006 Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that their Carsem-Suzhou factory achieved the ISO/TS (Technical Specification) 16949: 2000 Certification from TUV Rheinland Group, an internationally accredited quality evaluation company and third party registrar. The factory is a 172K sq. ft. (16K sq. m.) facility that is located in the Suzhou Industrial Park, which is in the province of Jiangsu 50 miles (80 km) west of Shanghai.

The ISO/TS 16949:2002 is a Quality Management System specific to the automotive industry, which includes all the requirements of the ISO 9001:2000 Quality Management System standards. The quality systems are currently endorsed by BMW, Daimler-Chrysler, Fiat, Ford, General Motors, PSA Peugeot-Citroen, Renault SA and Volkswagen AG, and are supported by various automotive trade associations such as AIAG (USA), SMMT (UK) and VDA (Germany). ISO/TS 16949, coupled with customer-specific requirements, define the quality system requirements for use in the automotive supply chain and provides for a global registration scheme.

Carsem-Suzhou has been shipping production volumes since July 2004 and currently offers full turnkey assembly and test services for the entire range of MLPQ (Quad) and MLPD (Dual) packages, which is a saw-singulated version of QFN & SON compliant packages per JEDEC's MO220 and MO229 standard's.

Mr. David Comley, Carsem's Group Managing Director, stated, "I am very proud of the Carsem-Suzhou team in achieving this major milestone in such a short period of time. We expect that, by the end of this year, the Suzhou factory will also achieve the Environmental Management System, ISO-14001, certification. The entire Carsem team is dedicated to providing our customers with products and services that comply with the most stringent industry standards."

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About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.