HEADLINE NEWS
CARSEM OFFERS STRIP TEST CAPABILITY Scotts Valley, CA -September 15, 2005 Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they now offer the ability to do strip testing of their High-Density Micro Leadframe Package (MLP) family using Micro Component Technology's ( MCT's) Tapestry SC Strip Test Handler. Strip test is a method of performing final electrical testing of devices while they are still in a matrix format on the leadframe strip that is used in the assembly process. By using a 2D code mark that is unique for each leadframe strip the Tapestry handler has the ability of providing an electronic "map" of the good devices which can then be laser marked prior to being singulated from the leadframe strip. In addition, because the devices are in a large matrix format, strip testing provides the ability to test multiple devices simultaneously, which improves throughput and reduces the cost of test. This is significant because, depending on the package body size, a single strip can contain from about 170 devices up to around 770 devices. The Tapestry SC handler takes advantage of the fact that the units in strip form are held in precise position and, coupled with the handlers advanced hardware and software design features, the test contactor alignment to the package land (lead) is highly accurate and repeatable. Because of this, the first pass final test yields for strip tested devices are significantly higher when compared to testing parts that have been singulated and tested in pick-and-place or gravity feed handlers. According to Allan Calamoneri, Carsem's Vice President of Test Business Development, "We have been working closely with MCT and some of our key customers on the implementation of this capability and it is clear that strip testing offers some tremendous advantages. Strip testing is not a panacea for testing devices but, when it makes good technical and economic sense, we have seen significant improvements in test yields, throughput, quality and overall lower costs. Additionally, strip test can provide enhanced process and data mining opportunities that have not previously been achieved with conventional test methods." Carsem MLP's are QFN (Quad Flat No-leaded) and SON (Small Outline No-lead) type packages that are compliant to JEDEC's MO220 and MO229 standards. END About Carsem About MCT
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