HEADLINE NEWS
FOR IMMEDIATE RELEASE
Carsem, Inc.
Press Contact: Paul Smith, Director of Marketing
Telephone Number: 831 438-6861
Fax Number: 831 438-6863
Email Address: psmith@carsem.com
Web site address: www.carsem.com

CARSEM ANNOUNCES NEW GENERAL MANAGER FOR M-SITE FACTORY

Scotts Valley, CA- 25 January, 2005- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today that Mr. T.L. Soo recently joined the company as the new General Manager of the Carsem M-Site factory. Mr. Soo is replacing the former General Manager Mr. Ian Ee, who after 13 years as the GM will retire at the end of January. Mr. Soo reports directly to Carsem's Chief Operating Officer, Mr. S.W. Woo.

Mr. Soo has over 20 years of experience in the semiconductor and electronics industry. Prior to joining Carsem he was the General Manager at Fairchild Semiconductor in Petaling Jaya, Malaysia, and prior to that he was the General Manager of Operations at Asteria Industries, which is an Electronics Manufacturing Services (EMS) company. He has also held various engineering management positions at Motorola and Siemens and holds an MBA from Henley Management College.

S.W. Woo stated, "I am very pleased to have T.L. join our company. His extensive experience in both the semiconductor and EMS industry will provide a broad vision and will add new dynamics to the growth of Carsem."

"Carsem has consistently been producing strong results in every aspect of the business. I am extremely delighted to be part of this dynamic team and look forward to helping drive the company to even greater heights," stated Mr. Soo.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.