CARSEM PREVAILS IN THEIR ITC PATENT LITIGATION

Scotts Valley, CA- November 18, 2004-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that the ITC (International Trade Commission) in Washington D.C., has issued an initial determination in favor of Carsem related to a complaint filed by Amkor Technology, Inc. on November 17, 2003. The complaint accused Carsem of infringing a total of 21 claims of Amkor's United States Patent Nos. 6,433,277, 6,455,356, and 6,630,728 by making, using, selling, offering for sale, and importing into the U.S. Carsem's MLP (Micro Leadframe Package) products.

Administrative Law Judge Honorable Charles E. Bullock determined that Amkor's asserted claims were invalid, not infringed or both, and that no violation of Section 337 of the Tarriff Act of 1930 occurred.

"I'm extremely pleased with the initial determination. We remain firm in our conviction that we had a strong position throughout this litigation and we are very pleased with our legal team of Townsend and Townsend and Crew; and Adduci, Mastriani and Schaumberg," stated Rick Flowers, Carsem's Vice President of North American sales.

David Comley, Carsem's Group Managing Director, stated, "Obviously we are very pleased with the judge's initial determination and feel vindicated in our original position that Carsem independently developed the MLP technology. We will continue to vigorously defend Carsem against any and all litigation we feel is unjust."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.