CARSEM'S CHINA FACTORY HOLDS GRAND OPENING CEREMONY

Scotts Valley, CA- Sept 28, 2004- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, recently held their official Grand Opening Ceremony for the Carsem-Suzhou factory. The 172K sq. ft. (16K sq. m.) facility is located in the Suzhou Industrial Park, which is in the province of Jiangsu 50 miles (80 km) west of Shanghai.

The Grand Opening was attended by executives from several of Carsem's customers including, Allegro, Elmos, Infineon, Micro Analog Systems, National Semiconductor, Semtech, Skyworks, STMicroelectronics, and Zarlink.

Among the executives in attendance from Carsem were Mr. David Comley, Group Managing Director, S.W Woo, Chief Operating Officer, and T.W. Hee, General Manager of Carsem-Suzhou. Carsem is a member company of Malaysian Pacific Industries, which is part of the Hong Leong Group. Representing Hong Leong was Mr. Kwek Leng San, Executive Chairman of Malaysian Pacific Industries and representing the Suzhou Industrial Park were Mr. Wang Ming, Standing Member of Jiangsu Provincial Party Committee, Secretary of Suzhou Municipal Party Committee and Mr. Wang Jin Hua, Deputy Secretary of Suzhou Municipal Party Committee, Chairman of Suzhou Industrial Park Administration Committee.

The Carsem-Suzhou factory began shipping production volumes in July this year and currently offers full turnkey assembly and test services for the production of the entire range of MLPQ (Quad) and MLPD (Dual) packages, which is a saw-singulated version of QFN & SON compliant packages per JEDEC's MO220 and MO229 standard's.

Mr. Comley, Carsem's Group Managing Director, stated, "This is an exciting milestone in the long history of the Carsem organization. It is our first factory to be located outside of Malaysia and now provides us with a tremendous opportunity to meet the huge growth potential of the China market."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.