CARSEM ANNOUNCES NEW VP OF TEST BUSINESS DEVELOPMENT

Scotts Valley, CA- 8 June, 2004- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today that Mr. Allan Calamoneri joined the company as the new Vice President of Test Business Development. Mr. Calamoneri will be based in the Scotts Valley office and he will be responsible for expanding Carsem's test services business including the support of customer test program and hardware development requirements.

Mr. Calamoneri has over fourteen years of experience that includes providing test engineering consulting services and the management of worldwide test manufacturing operations. Prior to joining Carsem he was the Vice President and COO of Test Spectrum West, Inc. He has held various managerial and technical positions at several companies including Vice President of World Wide Test Operations at ASAT, Inc., Director of Test Technology at Alpine Microsystems, Inc. and was formerly with Analog Devices, Inc.

David Comley, Carsem's Group-Managing Director, stated, "The test services portion of our business is crucial to the growth of our business and Allan brings a great deal of experience to the Carsem organization. I am confident that, with Allan's extensive knowledge and unique background, he will help us significantly expand our test services."

"I am very impressed with the Carsem organization and the commitment towards providing the best high quality test engineering and manufacturing services in our industry. I look forward to building the tools and processes that will enhance Carsem's long term ability to support our increasing customer needs," stated Mr. Calamoneri.

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.