CARSEM RECEIVES SPECIAL ACHIEVEMENT AWARD FROM ANALOG DEVICES.

City of Industry, CA-March 17, 2004-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced that they each recently received a Special Achievement Award for calendar year 2003 from Analog Devices, Inc.Ê (ADI).

During a ceremony held in Boston on March 10, 2004 the award was presented to David Comley, CarsemÕs Group Managing Director by John Hassett, Vice-President of Assembly and Test; and Gene Hornsby, Director of External Assembly & Test Foundry Quality.

Out of thousands of ADI suppliers around the world Carsem was among only ten to receive an achievement award.

"Analog Devices chose to recognize Carsem for their collaboration on the successful Plastics Assembly Project," said Gene Hornsby. "ADI was able to make a significant strategic change without affecting customer service or manufacturing metrics. We really appreciate the hard work and focus displayed by Carsem on helping us redeploy some of our assembly manufacturing."

Analog Devices is a leading manufacturer of precision high-performance integrated circuits used in analog and digital signal processing applications. The company is headquartered in Norwood, Massachusetts and employs approximately 8,600 people worldwide. It has manufacturing facilities in Massachusetts, California, North Carolina, Ireland, the Philippines, Taiwan and the United Kingdom.

David Comley, Group-Managing Director stated, "I am very pleased that Analog Devices chose Carsem for this prestigious award.Ê We have a very long history and strong relationship with ADI and this recognition speaks highly of our commitment towards providing the industry leaders with quality services and building technology partnerships with our customers. We look forward to working with ADI well into the future."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.