FOR IMMEDIATE RELEASE Carsem, Inc. Press Contact: Paul Smith, Director of Marketing Telephone Number: 831 438-6861 Fax Number: 831 438-6863 Email Address: psmith@carsem.com Web site address: www.carsem.com

Carsem Completes Construction of China Facility

Scotts Valley, CA-February 3, 2004- Carsem announced today that they completed the construction of their Carsem-Suzhou Ltd. facility, located in the province of Jiangsu, 50 miles (80 km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is located on 430K sq. ft. (40K sq. m) of land in the Suzhou Industrial Park.

The construction started in April 2003 and was completed in January this year. The initial staff was hired during the second quarter of 2003 and extensive training has already begun in Carsem's existing Malaysian factories. The assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual family will be installed during the first quarter of 2004. Customer qualifications will begin during the later part of the first quarter and the factory will be in full production by the end of the second quarter of 2004.

David Comley, Carsem's Group Managing Director, stated, "This is a major milestone towards meeting the tremendous growth potential of the China market as well as the rapidly increasing demand for the MLP package family. We have a significant number of key customers that have expressed the need for our MLP assembly and test capability in the China region and we anticipate a very rapid ramp in production volumes this year."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.