CARSEM ANNOUNCES ULTRA THIN MLP

City of Industry, CA-July 2, 2002-Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today the introduction of their Ultra Thin-Profile MLP (Micro Leadframe Package). The UT-MLPQ package has a nominal thickness of 0.5 mm and is compliant to JEDEC's QFN-MO220 requirements. This package is in addition to Carsem's current offering of both the Very-Very Thin-Profile (0.75 mm nominal thickness) and Very Thin-Profile (0.9 mm nominal thickness) options. All of Carsem MLP's, including the MLPM (JEDEC's MO229 ), are available in a Lead-Free (Pb-Free) option.

Smaller, Thinner, Cooler and Faster.
When compared to standard leaded packages with similar body sizes and lead count the MLP is considerably smaller and thinner with significantly improved thermal-electrical performance. The introduction of the UT-MLPQ provides a further enhancement to these characteristics.

Ê"The MLP family of packages is gaining wide acceptance by the industry and it will clearly become one of the more dominant packages. Over the next several years it will likely replace many of the existing leaded plastic packages," stated Paul Smith, Carsem's Director of Marketing. Smith further stated, "Carsem is well positioned to support our customers requirements for this package including the ability to offer full turn-key testing solutions."

David Comley, Carsem's Group Managing Director, stated,Ê "the introduction of the UT-MLPQ puts Carsem at the fore-front of providing the industry with enhanced performance and cost effective packaging solutions. We believe Carsem is the first to offer this Ultra Thin-Profile package and we will continue to invest in the development of new package technologies to meet our customer's need for smaller, thinner, and thermally-electrically efficient packages."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.