HEADLINE NEWS
FOR IMMEDIATE RELEASE
Carsem, Inc.
Press Contact: Paul Smith, Director of Marketing
Telephone Number: 831 438-6861
Fax Number: 831 438-6863
Email Address: psmith@carsem.com
Web site address: www.carsem.com

CARSEM RECEIVES SUPPLIER APPRECIATION AWARD FOR " EXCELLENCE IN SERVICES" FROM TEXAS INSTRUMENTS MALAYSIA.

City of Industry, CA- June 10, 2002- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced they recently received the Supplier Appreciation Award for "Excellence In Services" for the calendar year 2001 from Texas Instruments Malaysia, a wholly-owned subsidiary of the US-based technology company, Texas Instruments Inc.

The Texas Instruments Malaysia (TIM) award was based on an exacting supplier rating program. Among the factors that determined the qualified suppliers were - Cost, Environmental, Technology, Responsiveness, Assurance of Supply (on-time delivery, cycle time & yield) and Quality (CETRAQ).

"TI Malaysia chose to recognize Carsem because of their unparallel performance in meeting our requirements," said Mr. Tham Wai Keong, managing director of Texas Instruments Malaysia. "We appreciate the co-operative and customer orientated policy of Carsem and look forward to our continued relationship."

David Comley, Carsem's Group-Managing Director stated, "this award from TI clearly demonstrates our company is dedicated to working closely with our customers in providing the finest technology and support service in the industry. I am very proud to receive this award from one of the industry leaders and we look forward to growing our relationship with TI."

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.

About Texas Instruments
Texas Instruments Incorporated provides innovative DSP and Analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries. Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at www.ti.com.